SBOSA50A December   2021  – March 2022 TMP127-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 SPI Interface Timing
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low Power Consumption
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conversion Mode
      2. 8.4.2 Shutdown Mode
    5. 8.5 Programming
      1. 8.5.1 Temperature Data Format
      2. 8.5.2 Serial Bus Interface
        1. 8.5.2.1 Communication in Shutdown Mode
        2. 8.5.2.2 Communication in Continuous Conversion Mode
        3. 8.5.2.3 Internal Register Structure
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Read-Only Configuration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Read/Write Configuration
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TMP127-Q1 UNIT
DBV (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 168.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 85.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – °C/W
RθJB Junction-to-board thermal resistance 48.1 °C/W
ψJT Junction-to-top characterization parameter 27.5 °C/W
ψJB Junction-to-board characterization parameter 47.9 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.