SBOS835C May   2017  – October 2019 TMP464

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Sensor Fault
      5. 7.3.5 THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
          1. 7.5.1.4.1 Single Register Reads
          2. 7.5.1.4.2 Block Register Reads
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 TMP464 Register Reset
      3. 7.5.3 Lock Register
    6. 7.6 Register Maps
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Local and Remote Temperature Value Registers
        3. 7.6.1.3  Software Reset Register
        4. 7.6.1.4  THERM Status Register
        5. 7.6.1.5  THERM2 Status Register
        6. 7.6.1.6  Remote Channel Open Status Register
        7. 7.6.1.7  Configuration Register
        8. 7.6.1.8  η-Factor Correction Register
        9. 7.6.1.9  Remote Temperature Offset Register
        10. 7.6.1.10 THERM Hysteresis Register
        11. 7.6.1.11 Local and Remote THERM and THERM2 Limit Registers
        12. 7.6.1.12 Block Read - Auto Increment Pointer
        13. 7.6.1.13 Lock Register
        14. 7.6.1.14 Manufacturer and Device Identification Plus Revision Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at TA = –40°C to +125°C and V+ = 1.7 V to 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE MEASUREMENT
TLOCAL Local temperature sensor accuracy TA = –40°C to 100°C, V+ = 1.7 V to 3.6 V –0.75 ±0.125 0.75 °C
TA = –40°C to 125°C, V+ = 1.7 V to 3.6 V –1 ±0.5 1 °C
TREMOTE Remote temperature sensor accuracy TA = –10°C to 85°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V		 –0.75 ±0.125 0.75
TA = –40°C to 125°C, TD = –55°C to 150°C
V+ = 1.7 V to 3.6 V		 –1 ±0.5 1 °C
Local temperature error supply sensitivity V+ = 1.7 V to 3.6 V –0.15 ±0.05 0.15 °C/V
Remote temperature error supply sensitivity V+ = 1.7 V to 3.6 V –0.25 ±0.1 0.25 °C/V
Temperature resolution
(local and remote)		 0.0625 °C
ADC conversion time One-shot mode, per channel (local or remote) 16 17 ms
ADC resolution 13 Bits
Remote sensor source current High Series resistance 1 kΩ (maximum) 120 µA
Medium 45
Low 7.5
η Remote transistor ideality factor 1.008
SERIAL INTERFACE (SCL, SDA)
VIH High-level input voltage 0.7 × (V+) V
VIL Low-level input voltage 0.3 × (V+) V
Hysteresis 200 mV
SDA output-low sink current 20 mA
VOL Low-level output voltage IO = –20 mA, V+ ≥ 2 V 0.15 0.4 V
IO = –15 mA, V+ < 2 V 0.2 × V+ V
Serial bus input leakage current 0 V ≤ VIN ≤ 3.6 V –1 1 μA
Serial bus input capacitance 4 pF
DIGITAL INPUTS (ADD)
VIH High-level input voltage 0.7 × (V+) V
VIL Low-level input voltage –0.3 0.3 × (V+) V
Input leakage current 0 V ≤ VIN ≤ 3.6 V –1 1 μA
Input capacitance 4 pF
DIGITAL OUTPUTS (THERM, THERM2)
Output-low sink current VOL = 0.4 V 6 mA
VOL Low-level output voltage IO = –6 mA 0.15 0.4 V
IOH High-level output leakage current VO = V+ 1 μA
POWER SUPPLY
V+ Specified supply voltage range 1.7 3.6 V
IQ Quiescent current Active conversion, local sensor 240 375 µA
Active conversion, remote sensors 400 600
Standby mode (between conversions) 15 21
Shutdown mode, serial bus inactive 0.3 4
Shutdown mode, serial bus active, fS = 400 kHz 120 µA
Shutdown mode, serial bus active, fS = 2.56 MHz 300 µA
POR Power-on-reset threshold Rising edge 1.5 1.65 V
Falling edge 1 1.2 1.35
POH Power-on-reset hysteresis 0.2 V