SPRS439Q June   2007  – August 2022 TMS320F28232 , TMS320F28232-Q1 , TMS320F28234 , TMS320F28234-Q1 , TMS320F28235 , TMS320F28235-Q1 , TMS320F28332 , TMS320F28333 , TMS320F28334 , TMS320F28335 , TMS320F28335-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Related Products
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Signal Descriptions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings – Automotive
    3. 7.3  ESD Ratings – Commercial
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Power Consumption Summary
      1. 7.5.1 TMS320F28335/F28235 Current Consumption by Power-Supply Pins at 150-MHz SYSCLKOUT
      2. 7.5.2 TMS320F28334/F28234 Current Consumption by Power-Supply Pins at 150-MHz SYSCLKOUT
      3. 7.5.3 Reducing Current Consumption
      4. 7.5.4 Current Consumption Graphs
    6. 7.6  Electrical Characteristics
    7. 7.7  Thermal Resistance Characteristics
      1. 7.7.1 PGF Package
      2. 7.7.2 PTP Package
      3. 7.7.3 ZHH Package
      4. 7.7.4 ZAY Package
      5. 7.7.5 ZJZ Package
    8. 7.8  Thermal Design Considerations
    9. 7.9  Timing and Switching Characteristics
      1. 7.9.1 Timing Parameter Symbology
        1. 7.9.1.1 General Notes on Timing Parameters
        2. 7.9.1.2 Test Load Circuit
        3. 7.9.1.3 Device Clock Table
          1. 7.9.1.3.1 Clocking and Nomenclature (150-MHz Devices)
          2. 7.9.1.3.2 Clocking and Nomenclature (100-MHz Devices)
      2. 7.9.2 Power Sequencing
        1. 7.9.2.1 Power Management and Supervisory Circuit Solutions
        2. 7.9.2.2 Reset (XRS) Timing Requirements
      3. 7.9.3 Clock Requirements and Characteristics
        1. 7.9.3.1 Input Clock Frequency
        2. 7.9.3.2 XCLKIN Timing Requirements – PLL Enabled
        3. 7.9.3.3 XCLKIN Timing Requirements – PLL Disabled
        4. 7.9.3.4 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
        5. 7.9.3.5 Timing Diagram
      4. 7.9.4 Peripherals
        1. 7.9.4.1 General-Purpose Input/Output (GPIO)
          1. 7.9.4.1.1 GPIO - Output Timing
            1. 7.9.4.1.1.1 General-Purpose Output Switching Characteristics
          2. 7.9.4.1.2 GPIO - Input Timing
            1. 7.9.4.1.2.1 General-Purpose Input Timing Requirements
          3. 7.9.4.1.3 Sampling Window Width for Input Signals
          4. 7.9.4.1.4 Low-Power Mode Wakeup Timing
            1. 7.9.4.1.4.1 IDLE Mode Timing Requirements
            2. 7.9.4.1.4.2 IDLE Mode Switching Characteristics
            3. 7.9.4.1.4.3 IDLE Mode Timing Diagram
            4. 7.9.4.1.4.4 STANDBY Mode Timing Requirements
            5. 7.9.4.1.4.5 STANDBY Mode Switching Characteristics
            6. 7.9.4.1.4.6 STANDBY Mode Timing Diagram
            7. 7.9.4.1.4.7 HALT Mode Timing Requirements
            8. 7.9.4.1.4.8 HALT Mode Switching Characteristics
            9. 7.9.4.1.4.9 HALT Mode Timing Diagram
        2. 7.9.4.2 Enhanced Control Peripherals
          1. 7.9.4.2.1 Enhanced Pulse Width Modulator (ePWM) Timing
            1. 7.9.4.2.1.1 ePWM Timing Requirements
            2. 7.9.4.2.1.2 ePWM Switching Characteristics
          2. 7.9.4.2.2 Trip-Zone Input Timing
            1. 7.9.4.2.2.1 Trip-Zone Input Timing Requirements
          3. 7.9.4.2.3 High-Resolution PWM Timing
            1. 7.9.4.2.3.1 High-Resolution PWM Characteristics at SYSCLKOUT = (60–150 MHz)
          4. 7.9.4.2.4 Enhanced Capture (eCAP) Timing
            1. 7.9.4.2.4.1 Enhanced Capture (eCAP) Timing Requirements
            2. 7.9.4.2.4.2 eCAP Switching Characteristics
          5. 7.9.4.2.5 Enhanced Quadrature Encoder Pulse (eQEP) Timing
            1. 7.9.4.2.5.1 Enhanced Quadrature Encoder Pulse (eQEP) Timing Requirements
            2. 7.9.4.2.5.2 eQEP Switching Characteristics
          6. 7.9.4.2.6 ADC Start-of-Conversion Timing
            1. 7.9.4.2.6.1 External ADC Start-of-Conversion Switching Characteristics
            2. 7.9.4.2.6.2 ADCSOCAO or ADCSOCBO Timing
        3. 7.9.4.3 External Interrupt Timing
          1. 7.9.4.3.1 External Interrupt Timing Requirements
          2. 7.9.4.3.2 External Interrupt Switching Characteristics
          3. 7.9.4.3.3 External Interrupt Timing Diagram
        4. 7.9.4.4 I2C Electrical Specification and Timing
          1. 7.9.4.4.1 I2C Timing
        5. 7.9.4.5 Serial Peripheral Interface (SPI) Timing
          1. 7.9.4.5.1 Master Mode Timing
            1. 7.9.4.5.1.1 SPI Master Mode External Timing (Clock Phase = 0)
            2. 7.9.4.5.1.2 SPI Master Mode External Timing (Clock Phase = 1)
          2. 7.9.4.5.2 Slave Mode Timing
            1. 7.9.4.5.2.1 SPI Slave Mode External Timing (Clock Phase = 0)
            2. 7.9.4.5.2.2 SPI Slave Mode External Timing (Clock Phase = 1)
        6. 7.9.4.6 Multichannel Buffered Serial Port (McBSP) Timing
          1. 7.9.4.6.1 McBSP Transmit and Receive Timing
            1. 7.9.4.6.1.1 McBSP Timing Requirements
            2. 7.9.4.6.1.2 McBSP Switching Characteristics
          2. 7.9.4.6.2 McBSP as SPI Master or Slave Timing
            1. 7.9.4.6.2.1 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)
            2. 7.9.4.6.2.2 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)
            3. 7.9.4.6.2.3 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)
            4. 7.9.4.6.2.4 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)
            5. 7.9.4.6.2.5 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)
            6. 7.9.4.6.2.6 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)
            7. 7.9.4.6.2.7 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)
            8. 7.9.4.6.2.8 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)
      5. 7.9.5 JTAG Debug Probe Connection Without Signal Buffering for the MCU
      6. 7.9.6 External Interface (XINTF) Timing
        1. 7.9.6.1 USEREADY = 0
        2. 7.9.6.2 Synchronous Mode (USEREADY = 1, READYMODE = 0)
        3. 7.9.6.3 Asynchronous Mode (USEREADY = 1, READYMODE = 1)
        4. 7.9.6.4 XINTF Signal Alignment to XCLKOUT
        5. 7.9.6.5 External Interface Read Timing
          1. 7.9.6.5.1 External Interface Read Timing Requirements
          2. 7.9.6.5.2 External Interface Read Switching Characteristics
        6. 7.9.6.6 External Interface Write Timing
          1. 7.9.6.6.1 External Interface Write Switching Characteristics
        7. 7.9.6.7 External Interface Ready-on-Read Timing With One External Wait State
          1. 7.9.6.7.1 External Interface Read Switching Characteristics (Ready-on-Read, One Wait State)
          2. 7.9.6.7.2 External Interface Read Timing Requirements (Ready-on-Read, One Wait State)
          3. 7.9.6.7.3 Synchronous XREADY Timing Requirements (Ready-on-Read, One Wait State)
          4. 7.9.6.7.4 Asynchronous XREADY Timing Requirements (Ready-on-Read, One Wait State)
        8. 7.9.6.8 External Interface Ready-on-Write Timing With One External Wait State
          1. 7.9.6.8.1 External Interface Write Switching Characteristics (Ready-on-Write, One Wait State)
          2. 7.9.6.8.2 Synchronous XREADY Timing Requirements (Ready-on-Write, One Wait State)
          3. 7.9.6.8.3 Asynchronous XREADY Timing Requirements (Ready-on-Write, One Wait State)
        9. 7.9.6.9 XHOLD and XHOLDA Timing
          1. 7.9.6.9.1 XHOLD/ XHOLDA Timing Requirements (XCLKOUT = XTIMCLK)
          2. 7.9.6.9.2 XHOLD/XHOLDA Timing Requirements (XCLKOUT = 1/2 XTIMCLK)
      7. 7.9.7 Flash Timing
        1. 7.9.7.1 Flash Endurance for A and S Temperature Material
        2. 7.9.7.2 Flash Endurance for Q Temperature Material
        3. 7.9.7.3 Flash Parameters at 150-MHz SYSCLKOUT
        4. 7.9.7.4 Flash/OTP Access Timing
        5. 7.9.7.5 Flash Data Retention Duration
    10. 7.10 On-Chip Analog-to-Digital Converter
      1. 7.10.1 ADC Electrical Characteristics (over recommended operating conditions)
      2. 7.10.2 ADC Power-Up Control Bit Timing
        1. 7.10.2.1 ADC Power-Up Delays
        2. 7.10.2.2 Typical Current Consumption for Different ADC Configurations (at 25-MHz ADCCLK)
      3. 7.10.3 Definitions
      4. 7.10.4 Sequential Sampling Mode (Single-Channel) (SMODE = 0)
        1. 7.10.4.1 Sequential Sampling Mode Timing
      5. 7.10.5 Simultaneous Sampling Mode (Dual-Channel) (SMODE = 1)
        1. 7.10.5.1 Simultaneous Sampling Mode Timing
      6. 7.10.6 Detailed Descriptions
    11. 7.11 Migrating Between F2833x Devices and F2823x Devices
  8. 8 Detailed Description
    1. 8.1 Brief Descriptions
      1. 8.1.1  C28x CPU
      2. 8.1.2  Memory Bus (Harvard Bus Architecture)
      3. 8.1.3  Peripheral Bus
      4. 8.1.4  Real-Time JTAG and Analysis
      5. 8.1.5  External Interface (XINTF)
      6. 8.1.6  Flash
      7. 8.1.7  M0, M1 SARAMs
      8. 8.1.8  L0, L1, L2, L3, L4, L5, L6, L7 SARAMs
      9. 8.1.9  Boot ROM
        1. 8.1.9.1 Peripheral Pins Used by the Bootloader
      10. 8.1.10 Security
      11. 8.1.11 Peripheral Interrupt Expansion (PIE) Block
      12. 8.1.12 External Interrupts (XINT1–XINT7, XNMI)
      13. 8.1.13 Oscillator and PLL
      14. 8.1.14 Watchdog
      15. 8.1.15 Peripheral Clocking
      16. 8.1.16 Low-Power Modes
      17. 8.1.17 Peripheral Frames 0, 1, 2, 3 (PFn)
      18. 8.1.18 General-Purpose Input/Output (GPIO) Multiplexer
      19. 8.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 8.1.20 Control Peripherals
      21. 8.1.21 Serial Port Peripherals
    2. 8.2 Peripherals
      1. 8.2.1  DMA Overview
      2. 8.2.2  32-Bit CPU-Timer 0, CPU-Timer 1, CPU-Timer 2
      3. 8.2.3  Enhanced PWM Modules
      4. 8.2.4  High-Resolution PWM (HRPWM)
      5. 8.2.5  Enhanced CAP Modules
      6. 8.2.6  Enhanced QEP Modules
      7. 8.2.7  Analog-to-Digital Converter (ADC) Module
        1. 8.2.7.1 ADC Connections if the ADC Is Not Used
        2. 8.2.7.2 ADC Registers
        3. 8.2.7.3 ADC Calibration
      8. 8.2.8  Multichannel Buffered Serial Port (McBSP) Module
      9. 8.2.9  Enhanced Controller Area Network (eCAN) Modules (eCAN-A and eCAN-B)
      10. 8.2.10 Serial Communications Interface (SCI) Modules (SCI-A, SCI-B, SCI-C)
      11. 8.2.11 Serial Peripheral Interface (SPI) Module (SPI-A)
      12. 8.2.12 Inter-Integrated Circuit (I2C)
      13. 8.2.13 GPIO MUX
      14. 8.2.14 External Interface (XINTF)
    3. 8.3 Memory Maps
    4. 8.4 Register Map
      1. 8.4.1 Device Emulation Registers
    5. 8.5 Interrupts
      1. 8.5.1 External Interrupts
    6. 8.6 System Control
      1. 8.6.1 OSC and PLL Block
        1. 8.6.1.1 External Reference Oscillator Clock Option
        2. 8.6.1.2 PLL-Based Clock Module
        3. 8.6.1.3 Loss of Input Clock
      2. 8.6.2 Watchdog Block
    7. 8.7 Low-Power Modes Block
  9. 9 Applications, Implementation, and Layout
    1. 9.1 TI Reference Design
  10. 10Device and Documentation Support
    1. 10.1 Getting Started and Next Steps
    2. 10.2 Device and Development Support Tool Nomenclature
    3. 10.3 Tools and Software
    4. 10.4 Documentation Support
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Redesign Details
    2. 11.2 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZAY|179
  • PGF|176
  • PTP|176
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison

Table 5-1 F2833x Device Comparison
FEATURE TYPE(1) F28335
F28335-Q1
(150 MHz)		 F28334
(150 MHz)		 F28333
(100 MHz)		 F28332
(100 MHz)
Instruction cycle – 6.67 ns 6.67 ns 10 ns 10 ns
Floating-point unit – Yes Yes Yes Yes
3.3-V on-chip flash (16-bit word) – 256K 128K 256K 64K
Single-access RAM (SARAM)
(16-bit word)		 – 34K 34K 34K 26K
One-time programmable (OTP) ROM
(16-bit word)		 – 1K 1K 1K 1K
Code security for on-chip flash/SARAM/OTP blocks – Yes Yes Yes Yes
Boot ROM (8K × 16) – Yes Yes Yes Yes
16/32-bit External Interface (XINTF) 1 Yes Yes Yes Yes
6-channel Direct Memory Access (DMA) 0 Yes Yes Yes Yes
PWM channels 0 ePWM1/2/3/4/5/6 ePWM1/2/3/4/5/6 ePWM1/2/3/4/5/6 ePWM1/2/3/4/5/6
HRPWM channels 0 ePWM1A/2A/3A/4A/5A/6A ePWM1A/2A/3A/4A/5A/6A ePWM1A/2A/3A/4A/5A/6A ePWM1A/2A/3A/4A
32-bit capture inputs or auxiliary PWM outputs 0 eCAP1/2/3/4/5/6 eCAP1/2/3/4 eCAP1/2/3/4/5/6 eCAP1/2/3/4
32-bit QEP channels (four inputs/channel) 0 eQEP1/2 eQEP1/2 eQEP1/2 eQEP1/2
Watchdog timer – Yes Yes Yes Yes
12-bit ADC No. of channels 2 16 16 16 16
MSPS 12.5 12.5 12.5 12.5
Conversion time 80 ns 80 ns 80 ns 80 ns
32-bit CPU timers – 3 3 3 3
Multichannel Buffered Serial Port (McBSP)/SPI 1 2 (A/B) 2 (A/B) 2 (A/B) 1 (A)
Serial Peripheral Interface (SPI) 0 1 1 1 1
Serial Communications Interface (SCI) (UART-compatible) 0 3 (A/B/C) 3 (A/B/C) 3 (A/B/C) 2 (A/B)
Enhanced Controller Area Network (eCAN) 0 2 (A/B) 2 (A/B) 2 (A/B) 2 (A/B)
Inter-Integrated Circuit (I2C) 0 1 1 1 1
General-purpose I/O pins (shared) – 88 88 88 88
External interrupts – 8 8 8 8
Packaging 176-Pin PGF – Yes Yes Yes Yes
176-Pin PTP – Yes Yes – Yes
179-Ball ZHH – Yes Yes – Yes
179-Ball ZAY – Yes Yes – –
176-Ball ZJZ – Yes Yes – Yes
Temperature options A: –40°C to 85°C – PGF, ZHH, ZAY, ZJZ PGF, ZHH, ZAY, ZJZ PGF PGF, ZHH, ZJZ
S: –40°C to 125°C – PTP, ZJZ PTP, ZJZ – PTP, ZJZ
Q: –40°C to 125°C
(AEC Q100 Qualification)		 – PTP, ZJZ PTP, ZJZ – PTP, ZJZ
(1) A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor differences between devices that do not affect the basic functionality of the module. These device-specific differences are listed in the C2000 Real-Time Control MCU Peripherals Reference Guide and the TMS320x2833x, TMS320x2823x Real-Time Microcontrollers Technical Reference Manual.
Table 5-2 F2823x Device Comparison
FEATURE TYPE(1) F28235
F28235-Q1
(150 MHz)		 F28234
F28234-Q1
(150 MHz)		 F28232
F28232-Q1
(100 MHz)
Instruction cycle – 6.67 ns 6.67 ns 10 ns
Floating-point unit – No No No
3.3-V on-chip flash (16-bit word) – 256K 128K 64K
Single-access RAM (SARAM)
(16-bit word)		 – 34K 34K 26K
One-time programmable (OTP) ROM
(16-bit word)		 – 1K 1K 1K
Code security for on-chip flash/SARAM/OTP blocks – Yes Yes Yes
Boot ROM (8K × 16) – Yes Yes Yes
16/32-bit External Interface (XINTF) 1 Yes Yes Yes
6-channel Direct Memory Access (DMA) 0 Yes Yes Yes
PWM channels 0 ePWM1/2/3/4/5/6 ePWM1/2/3/4/5/6 ePWM1/2/3/4/5/6
HRPWM channels 0 ePWM1A/2A/3A/4A/5A/6A ePWM1A/2A/3A/4A/5A/6A ePWM1A/2A/3A/4A
32-bit capture inputs or auxiliary PWM outputs 0 eCAP1/2/3/4/5/6 eCAP1/2/3/4 eCAP1/2/3/4
32-bit QEP channels (four inputs/channel) 0 eQEP1/2 eQEP1/2 eQEP1/2
Watchdog timer – Yes Yes Yes
12-bit ADC No. of channels 2 16 16 16
MSPS 12.5 12.5 12.5
Conversion time 80 ns 80 ns 80 ns
32-bit CPU timers – 3 3 3
Multichannel Buffered Serial Port (McBSP)/SPI 1 2 (A/B) 2 (A/B) 1 (A)
Serial Peripheral Interface (SPI) 0 1 1 1
Serial Communications Interface (SCI) (UART-compatible) 0 3 (A/B/C) 3 (A/B/C) 2 (A/B)
Enhanced Controller Area Network (eCAN) 0 2 (A/B) 2 (A/B) 2 (A/B)
Inter-Integrated Circuit (I2C) 0 1 1 1
General-purpose I/O pins (shared) – 88 88 88
External interrupts – 8 8 8
Packaging 176-Pin PGF – Yes Yes Yes
176-Pin PTP – Yes Yes Yes
179-Ball ZHH – Yes Yes Yes
179-Ball ZAY – – Yes Yes
176-Ball ZJZ – Yes Yes Yes
Temperature options A: –40°C to 85°C – PGF, ZHH, ZJZ PGF, ZHH, ZAY, ZJZ PGF, ZHH, ZAY, ZJZ
S: –40°C to 125°C – PTP, ZJZ PTP, ZJZ PTP, ZJZ
Q: –40°C to 125°C
(AEC Q100 Qualification)		 – PTP, ZJZ PTP, ZJZ PTP, ZJZ
(1) A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor differences between devices that do not affect the basic functionality of the module. These device-specific differences are listed in the C2000 Real-Time Control MCU Peripherals Reference Guide and the TMS320x2833x, TMS320x2823x Real-Time Microcontrollers Technical Reference Manual.