SPNS253A May 2018 – September 2019 TMS570LC4357-EP
PRODUCTION DATA.
°C / W | ||
---|---|---|
RΘJA | Junction-to-free air thermal resistance, still air (includes 5×5 thermal via cluster in 2s2p PCB connected to 1st ground plane) | 14.3 |
RΘJB | Junction-to-board thermal resistance (includes 5×5 thermal via cluster in 2s2p PCB connected to 1st ground plane) | 5.49 |
RΘJC | Junction-to-case thermal resistance (2s0p PCB) | 5.02 |
ΨJT | Junction-to-package top, still air (includes 5×5 thermal via cluster in 2s2p PCB connected to 1st ground plane) | 0.29 |
ΨJB | Junction-to-board, still air (includes 5×5 thermal via cluster in 2s2p PCB connected to 1st ground plane) | 6.41 |