SCDS445B May   2022  – March 2023 TMUX4051 , TMUX4052 , TMUX4053

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information: TMUX405x
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics
    6. 7.6 AC Performance Characteristics
    7. 7.7 Timing Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  Break-Before-Make
    6. 8.6  tON(EN) and tOFF(EN)
    7. 8.7  Propagation Delay
    8. 8.8  Charge Injection
    9. 8.9  Off Isolation
    10. 8.10 Crosstalk
    11. 8.11 Bandwidth
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail-to-Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Device Functional Modes
      5. 9.3.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Application Curves
    6. 10.6 Power Supply Recommendations
    7. 10.7 Layout
      1. 10.7.1 Layout Guidelines
      2. 10.7.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.6 tON(EN) and tOFF(EN)

Turn-on time is defined as the time taken by the output of the device to rise to 10% after the enable has risen past the 50% threshold. The 10% measurement is utilized to provide the timing of the device, system level timing can then account for the time constant added from the load resistance and load capacitance. #X582 shows the setup used to measure transition time, denoted by the symbol tON(EN).

Turn-off time is defined as the time taken by the output of the device to fall to 90% after the enable has fallen past the 50% threshold. The 90% measurement is utilized to provide the timing of the device, system level timing can then account for the time constant added from the load resistance and load capacitance. #X582 shows the setup used to measure transition time, denoted by the symbol tOFF(EN).

Figure 8-6 Turn-On and Turn-Off Time Measurement Setup