SLVSIV4A September   2025  – November 2025 TMUXHS221F

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Characteristics
    7. 5.7 Timing Requirements
  7. 6 Parameter Measurement Information
    1. 6.1 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Extended 1.2V Compatibility
      2. 7.3.2 Overvoltage Protection
      3. 7.3.3 Powered-off Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pin Functions
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application 1
    3. 8.3 Typical Application 2
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.2 Detailed Design Procedure

The TMUXHS221F can be properly operated without any external components. However, TI recommends that unused pins must be connected to ground through a 50Ω resistor to prevent signal reflections back into the device. TI does recommend a 100nF bypass capacitor placed close to TMUXHS221F VCC pin.