SLASF51 February 2024 TMUXHS4446
PRODUCTION DATA
On a high-K board, TI always recommends to solder the PowerPAD™ integrated circuit package onto the thermal land. A thermal land is the area of solder-tinned-copper underneath the Power-pad package. On a high-K board, the TMUXHS4446 can operate over the full temperature range by soldering the Power-pad onto the thermal land without vias.
For high speed layout guidelines refer to the High-Speed Layout Guidelines for Signal Conditioners and USB Hubs application note.
On a low-K board, use a 1-oz Cu trace to connect the GND pins to the thermal land for the device to operate across the temperature range. A general PCB design guide for Power-pad packages is provided in the Power-pad Thermally-Enhanced Package application note.