SLASF51 February   2024 TMUXHS4446

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 High-Speed Performance Parameters
    7. 5.7 Switching Characteristics
    8. 5.8 I2C Timing Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High-Speed Differential Signal Switching
      2. 6.3.2 Low-Speed SBU Signal Switching
      3. 6.3.3 GPIO and I2C Control Modes
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application: USB-C with DP Alternate Mode - Source
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

over operating free-air temperature and supply voltage range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Supply Pin (VCC)
ICC Device active current 0V ≤ VCM ≤ 1.8V 380 530 µA
ISTDN Device shutdown current All switches open; CONF[2:0] = 000, I2C mode 5 10 µA
All switches open; CONF[2:0] = 000, GPIO Mode 0.5 2.5 µA
High Speed Pins ([SS/C]TXx[+/-], [SS/C]RXx[+/-], DPx[+/-])
CON Output ON capacitance to GND f =  5GHz 0.3 pF
COFF Output OFF capacitance to GND CONF[2:1] = 00 0.3 pF
IIH,HS,SEL Input high current, selected high-speed pins  VIN = 1.8V for selected port p and n pins 6 µA
IIH,HS,NSEL Input high current, non-selected high-speed pins  VIN = 1.8V for non-selected port 110 µA
IIL,HS Input low current, high-speed pins  VIN = 0V 1 µA
IFS,HS Failsafe leakage current for HS data pins Data pins = 1.8V VCC = 0V 10 µA
RA,p2n DC Impedance between C[Tx/Rx]x+ and C[Tx/Rx]x- pins 20 KΩ
SBU Pins (SBUx, AUX[+/-])
IIH,SBU Input high current, SBU, AUX pins  VIN = VCC for selected port 0.16 µA
IIL,SBU Input low current, SBU, AUX pins  VIN = 0V 0.1 µA
IFS,SBU Failsafe leakage current for  SBU pins SBU pins = 3.6V, VCC = 0V 10 µA
CON,SBU Output ON capacitance to GND f = 1MHz 6 8 pF
COFF,SBU Output OFF capacitance to GND f = 1MHz 6 8 pF
RON,SBU Output ON resistance 0 ≤ VIN ≤ 3.3V; IO = –8mA 7 Ω
Control Pins (MODE[1:0], CONF[2:0], A[1:0], SDA, SCL)
IIH,CTRL Input high current, control pins VIN = VCC  1 µA
IIL,CTRL Input low current, control pins VIN = 0V 1 µA
CIN Input capacitance 20 pF