SLAS997B March   2014  – January 2015 TPA6166A2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics, Audio Amplifiers
    7. 6.7 Electrical Characteristics, Mic Preamplifier and Bias
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 I2C Interface
        1. 7.3.1.1 Single and Multiple Byte Transfers
        2. 7.3.1.2 Single-Byte Write
        3. 7.3.1.3 Multiple-Byte Write and Incremental Multiple-Byte Write
        4. 7.3.1.4 Single-Byte Read
        5. 7.3.1.5 Multiple-Byte Read
      2. 7.3.2 Accessory Detection
      3. 7.3.3 Audio Playback Channel
        1. 7.3.3.1 Class-G Headphone Amplifier
          1. 7.3.3.1.1 Headphone Charge Pump
        2. 7.3.3.2 Out-of-Band and Input RF Noise Rejection
      4. 7.3.4 Mic Channel
      5. 7.3.5 Button Press Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 I2C Options
      2. 7.4.2 System in Shutdown Mode
      3. 7.4.3 System in Sleep Mode
        1. 7.4.3.1 Accessory Not Inserted
        2. 7.4.3.2 Accessory Inserted
        3. 7.4.3.3 Button Detection During Sleep Mode
      4. 7.4.4 System in Wake-Up Mode
        1. 7.4.4.1 Accessory Not Inserted
        2. 7.4.4.2 Accessory Inserted
        3. 7.4.4.3 Audio Not Playing or Not in Voice Call
        4. 7.4.4.4 High Impedance Line Out Load
        5. 7.4.4.5 Button Detection
    5. 7.5 Register Maps
      1. 7.5.1 Register Functional Overview
      2. 7.5.2 Initialization
        1. 7.5.2.1 Reserved Registers
        2. 7.5.2.2 Fixed Registers
        3. 7.5.2.3 Other Registers
      3. 7.5.3 Typical Use Case Modes
      4. 7.5.4 Recommended Software Flow Chart
      5. 7.5.5 Register Map Summary
      6. 7.5.6 Detailed Register Descriptions
        1. 7.5.6.1  Register 0x00: Config and Device Status Register 1
        2. 7.5.6.2  Register 0x01: Config and Device Status Register 2
        3. 7.5.6.3  Register 0x02: Config and Device Status Register 2
        4. 7.5.6.4  Register 0x03: Reserved Register
        5. 7.5.6.5  Register 0x04: Interrupt Mask Register 1
        6. 7.5.6.6  Register 0x05: Interrupt Mask Register 2
        7. 7.5.6.7  Register 0x06: Reserved Register
        8. 7.5.6.8  Register 0x07: Headphone Volume Register 1
        9. 7.5.6.9  Register 0x08: Headphone Volume Control Register 2
        10. 7.5.6.10 Register 0x09: Microphone Bias Control Register
        11. 7.5.6.11 Register 0x0a: Reserved
        12. 7.5.6.12 Register 0x0b: Revision ID Register
        13. 7.5.6.13 Register 0x0c: Reserved Register
        14. 7.5.6.14 Registers 0x0d to 0x10: Reserved Registers
        15. 7.5.6.15 Register 0x11: Reserved
        16. 7.5.6.16 Register 0x12: Reserved
        17. 7.5.6.17 Register 0x13: Reserved
        18. 7.5.6.18 Register 0x14: Reserved Register
        19. 7.5.6.19 Register 0x15: Keyscan Debounce Register
        20. 7.5.6.20 Register 0x16: Keyscan Delay Register
        21. 7.5.6.21 Register 0x17: Passive Multi Button Keyscan Data Register
        22. 7.5.6.22 Register 0x18: Jack Detect Test Hardware Settings
        23. 7.5.6.23 Register 0x19:State Register
        24. 7.5.6.24 Register 0x1a: Jack Detect Test Hardware Settings
        25. 7.5.6.25 Registers 0x1b: Reserved
        26. 7.5.6.26 Register 0x1c: Clock Control
        27. 7.5.6.27 Register 0x1d: Enable Register 1
        28. 7.5.6.28 Register 0x1e: Enable Register 2
        29. 7.5.6.29 Register 0x1F: Reserved
        30. 7.5.6.30 Register 0x66: Clock Flex Register
        31. 7.5.6.31 Register 0x6F: Clock Set Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Charge Pump Capacitors
        2. 8.2.2.2 Audio Input ac Coupling Capacitors
        3. 8.2.2.3 Suggested Output EMI Filter
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Decoupling Capacitors
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Pad Sizing
  11. 11Device and Documentation Support
    1. 11.1 Development Support
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating temperature range, TA = 25°C (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage, VDD –0.3 2 V
Microphone supply voltage, MICVDD –0.3 3.9 V
Output continuous total power dissipation See Thermal Information
Storage temperature, Tstg –65 85 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VDD Supply voltage 1.7 1.9 V
MICVDD Microphone supply voltage 2.4 3.6 V
TA Operating temperature –25 85 °C
CL,Max Maximum load capacitance Line Driver Application, RL = 10 kΩ, AV ≥ 0 dB, specified by design 470 pF
Line Driver Application, RL = 10 kΩ, AV ≤ 0 dB, LO_EXT_STAB = 1, specified by design 470
Headphone Application, RL = 32 Ω, specified by design 200
TJ Operating junction temperature –25 150 °C

6.4 Thermal Information

THERMAL METRIC(1) TPA6166A2 UNIT
YFF (WSCP)
25 PINS
RθJA Junction-to-ambient thermal resistance 67 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 18
RθJB Junction-to-board thermal resistance 38
ψJT Junction-to-top characterization parameter 0.1
ψJB Junction-to-board characterization parameter 36
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

VDD =00 1.8 V, MICVDD = 3.0 V, AV = 0 dB, CIN = 0.47 µF, CFLY = 1.0 μF, CCPVDD = CCPVSS = 1.0 μF, RHP = 32 Ω, outputs in phase, TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH Input logic high SDA, SCL 1.4 V
VIL Input logic low SDA, SCL 0.4
VOL Output logic low IRQ IOL = 3 mA pullup current 0.2×VDD
|IIH| Logic high input leakage current SDA, SCL 1 µA
|IIL| Logic low input leakage current SDA, SCL 1
|IOH| Logic high output leakage current IRQ VIRQ = 3.3 V 1
Power consumption Audio playback (both channels), no signal into 32 Ω IVDD 2.38 mA
IMICVDD 0.21 mA
PCONS(1) 4.91 mW
Audio playback (both channels), 100-µW output into 32 Ω IVDD 3.74 mA
IMICVDD 0.21 mA
PCONS(1) 7.35 mW
2-way call, no signal into 32 Ω IVDD 2.36 mA
IMICVDD 0.96 mA
PCONS(1) 6.35 mW
2-way call, 100-µW output into 32 Ω IVDD 3.68 mA
IMICVDD 0.96 mA
PCONS(1) 8.74 mW
Accessory not inserted IVDD 10.84 µA
IMICVDD 1.05 µA
PCONS(1) 22.7 µW
Accessory not inserted, mechanical switch is open (JACK_SENSE=1) IVDD 150.9 µA
IMICVDD 1.05 µA
PCONS(1) 278.3 µW
Accessory inserted and in sleep mode IVDD 108.1 µA
IMICVDD 1.06 µA
PCONS(1) 197.8 µW
(1) Total power consumption from VDD and MICVDD.

6.6 Electrical Characteristics, Audio Amplifiers

VDD = 1.8 V, MICVDD = 3.0 V, AV = 0 dB, CIN = 0.47 µF, CFLY = 1.0 μF, CCPVDD = CCPVSS = 1.0 μF, RL = 32 Ω, outputs in phase, TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
HEADPHONE AND LINE-OUT AMPLIFIERS
Programmable gain range -42 6 dB
AV,Max AV = 6 dB 5.0 6.0 7.0 dB
AV,Min AV = -42 dB -43 -42 -41 dB
Gain step size -42 dB ≤ AV ≤ 6 dB 1 dB
ΔAV Gain matching Between left and right channels –0.5 0.5 dB
Mute attenuation 103.7 dB
PO Output power THD+N = 1%, f = 1 kHz, RL = 32 Ω, single channel on 29.1 mW
THD+N = 1%, f = 1 kHz, RL = 32 Ω,
C both channels on		 23.2
THD+N = 1%, f = 1 kHz, RL = 16 Ω, single channel on 43.0
THD+N = 1%, f = 1 kHz, RL = 16 Ω, The processing of Request 596221 was completed at 10:19 on 28 Jan 2015. Click here to access the data Click here to access the HTML data both channels on 30.2
THD+N Total harmonic distortion plus noise RL = 16 Ω, PO = 10 mW, f = 1 kHz 0.021%
RL = 16 Ω, PO = 0.1 mW, f = 1 kHz 0.057%
RL = 10 kΩ, VOUT = 1 VRMS, f = 1 kHz 0.014%
PSRR Power supply rejection ratio f = dc, VDD = 1.7 V to 1.9 V, AV = 0 dB 70 91 dB
f = 217 Hz, 100 mVP-P ripple on VDD 88
f = 10 kHz, 100 mVP-P ripple on VDD 71
EN Output noise(1) AV = 0 dB 8.0 µVRMS
AV = -30 dB 2.0
AV = -42 dB 2.0
Crosstalk between left and right channels RL = 16 Ω, f = 1 kHz, PO = 5 mW –56 dB
RL = 32 Ω, f = 1 kHz, PO = 25 mW –62
RIN Amplifier input resistance 20 kΩ
VOOS Output offset voltage AV = 0 dB –0.5 0.5 mV
VOUT,Max Max line output voltage RL = 10 kΩ 1 VRMS
fC,LPF Input low-pass filter 3-dB cutoff frequency(2) AV = 0 dB 45.1 kHz
Low-pass filter passband gain(2) f = 10 Hz to 15 kHz, dc-coupled inputs with VCM = 0 V –0.4 dB
Low-pass filter stopband gain(2) f = 145 kHz –16 dB
fCP Charge pump frequency 1.3 MHz
Click and pop(1) AV = 0 dB, Volume Slewing Enabled, RL = 32 Ω, peak voltage, 32 samples / second Into shutdown –83 dBV
Out of shutdown –69
Power consumption(3) PO = 0.5 mW, RL = 32 Ω 6.2 mW
PO = 5 mW, RL = 32 Ω, THRH = 1 13.3
PO = 30 mW, RL = 32 Ω, THRH = 0 56.9
RL Minimum headphone load 32 7.8 Ω
(1) A-weighted
(2) Measured with respect to gain at 997 Hz
(3) Per output channel

6.7 Electrical Characteristics, Mic Preamplifier and Bias

VDD = 1.8 V, MICVDD = 3.0 V, TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MICROPHONE BIAS
VBIAS Microphone bias voltage Programmed for high value, MICVDD ≥ 2.8 V 2.45 2.6 2.75 V
Programmed for low value 1.88 2.0 2.12
IOUT Max bias output current Internal bias resistor bypassed (MICR = 011) 1.2 mA
RBIAS Bias output resistance MICR = 000 2.09 2.2 2.31 kΩ
MICR = 001 2.47 2.6 2.73
MICR = 010 2.85 3.0 3.15
MICR = 011 0.13
EN Bias output noise(1) Between SLEEVE and RING2, BW = 100 Hz to 7 kHz, 2.2 kΩ load between SLEEVE and RING2, MICR = 000, VBIAS = 2.0 V 2.0 µVRMS
PSRR Power supply rejection ratio Measured between SLEEVE and RING2, 2.2 kΩ load between SLEEVE and RING2, MICR = 000, VBIAS = 2.6 V f = dc, MICVDD = 2.8 V to 3.6 V 92 dB
f = 2 kHz, 100 mVP-P ripple, MICVDD = 3.0 V 73
f = 2 kHz, 100 mVP-P ripple, MICVDD = 2.8 V 73
MicZ Microphone Capsule Impedance Measured between Mic and GND before insertion 1500 20000 Ω
MICROPHONE PREAMPLIFIER
AV Preamplifier gain Programmed for high value, f = 997 Hz 23 24 25 dB
Programmed for low value, f = 997 Hz 11 12 13
EN Input referred noise(1) f = 100 Hz to 7 kHz, AV = 24 dB, Mic on SLEEVE, 2.2 kΩ load between SLEEVE and RING2, MICR = 000, VBIAS = 2.0 V 3.4 µVRMS
THD+N Total harmonic distortion plus noise VOUT = 1 VRMS 0.095%
PSRR Power supply rejection ratio Measured between MOUTP-MOUTN, 6.04 kΩ between SLEEVE and RING2, MICR = 010, VBIAS = 2.0 V, f = dc, MICVDD = 2.4 V to 3.6 V 74 dB
Measured between MOUTP-MOUTN, 2.2 kΩ between SLEEVE and RING2, MICR = 000, VBIAS = 2.6 V f = dc, MICVDD = 2.8 V to 3.6 V  109.5
f = 2 kHz, 100 mVP-P ripple on MICVDD 78
VCMO Output Common Mode MICVDD = 2.4 V – 3.6V 0.4×MICVDD V
fC,LO Lower -3 dB frequency of HPF(2) 20 Hz
fC,HI Upper -3 dB frequency of amplifier(2) 260 kHz
(1) A-weighted
(2) Measured with respect to gain at 997 Hz

6.8 Timing Requirements

For I2C interface signals and voltage power-up sequence, over recommended operating conditions (unless otherwise noted). Timing is specified by design.
MIN MAX UNIT
fSCL Frequency, SCL No wait states 400 kHz
tw(H) Pulse duration, SCL high 0.6 μs
tw(L) Pulse duration, SCL low 1.3 μs
tsu1 Setup time, SDA to SCL 100 ns
th1 Hold time, SCL to SDA 10 ns
t(buf) Bus free time between stop and start condition 1.3 μs
tsu2 Setup time, SCL to start condition 0.6 μs
th2 Hold time, start condition to SCL 0.6 μs
tsu3 Setup time, SCL to stop condition 0.6 μs
tSP Pulse width of surpressed spike 0 50 ns
T0027-02_LOS675.gifFigure 1. SCL and SDA Timing
T0028-01_LES091.gifFigure 2. Start and Stop Conditions Timing

6.9 Typical Characteristics

VDD = 1.8 V, MICVDD = 3.0 V, AV = 0 dB, CIN = 0.47 µF, CFLY = 1.0 μF, CCPVDD = CCPVSS = 1.0 μF, RHP = 32 Ω, outputs in phase, TA = 25°C (unless otherwise noted).
Fig03_EVM1_HP_THDVsPower_Load16ohms.gif
VDD = 1.8 V RL = 16 Ω Gain = 0 dB
f - 1 kHz
Figure 3. Headphone Total Harmonic Distortion + Noise vs Output Power
Fig05_EVM1_HP_THDVsFreq_Load16ohms.gif
VDD = 1.8 V RL = 16 Ω Gain = 0 dB
Figure 5. Headphone Total Harmonic Distortion + Noise vs Frequency
Fig07_EVM3_PSRRVSFrequency.gif
VDD = 1.8 V RL = 16 Ω Gain = 0 dB
Figure 7. Headphone Psrr vs Frequency
Fig09_EVM1_Supply_current_Vs_output_power_32ohm.gif
VDD = 1.8 V RL = 32 Ω Gain = 0 dB
f = 1kHz THRH = 0
Figure 9. Headphone Supply Current vs Total Output Power
Fig11_EVM1_ShutdownWaveform_VolumeSlewingEnabled_los796.gif
VIN = 0.5 VRMS RL = 16 Ω
Volume slewing enabled
Device enabled at 0 ms
Figure 11. Headphone Shutdown Waveforms vs Time
Fig13_EVM1_OutputSpectrum_m30dBV_m30dBgain.gif
VDD = 1.8 V RL = 16 Ω Gain = –30 dB
A weighted
Figure 13. Headphone Output Spectrum vs Frequency
Fig15_MIC_THDN_vs_Frequency_12dB.gif
VDD = 1.8 V VOUT = 1 VRMS Gain = 12 dB
Figure 15. Mic Preamplifier Total Harmonic Distortion + Noise vs Frequency
Fig17_EVM1_MicpreampFrequencyResponse_12dB.gif
MIC VDD = 3.0 V Gain = 12 dB
Figure 17. Mic Preamplifier Frequency Response
Fig19_EVM1_MicpreampPSRRVSFrequency.gif
VDD = 1.8 V MIC VDD = 3.0 V
Figure 19. Mic Preamplifier + Micbias PSRR vs Frequency
Fig21_EVM2_Micpreamp_outputSpectrum_24dB.gif
MIC VDD = 3.0 V Gain = 24 dB No signal input
Figure 21. Mic Preamplifier + Micbias Output Frequency Spectrum
Fig04_EVM1_HP_THDVsPower_Load32ohms.gif
VDD = 1.8 V RL = 32 Ω Gain = 0 dB
f - 1 kHz
Figure 4. Headphone Total Harmonic Distortion + Noise vs Output Power
Fig06_EVM1_OutputPowerVsLoadResistance.gif
VDD = 1.8 V f = 1 kHz Gain = 0 dB
THD+N = 1%
Figure 6. Headphone Output Power vs Load Resistance
Fig08_EVM1_Supply_current_Vs_output_power_16ohm.gif
VDD = 1.8 V RL = 16 Ω Gain = 0 dB
f = 1kHz THRH = 0
Figure 8. Headphone Supply Current vs Total Output Power
Fig10_EVM1_Startup_Waveform_VolumeSlewingEnabled_los796.gif
VIN = 0.5 VRMS RL = 16 Ω
Volume slewing enabled
Device enabled at 0 ms
Figure 10. Headphone Start-up Waveforms vs Time
Fig12_EVM1_OutputSpectrum_m60dBV.gif
VDD = 1.8 V RL = 16 Ω Gain = 0 dB
A weighted
Figure 12. Headphone Output Spectrum vs Frequency
Fig14_EVM1_Audio_ac_characteristics.gif
VDD = 1.8 V RL = 16 Ω Gain = 0 dB
Figure 14. Audio Filter Frequency Response
Fig16_MIC_THDN_vs_Frequency_24dB.gif
VDD = 1.8 V VOUT = 1 VRMS Gain = 24 dB
Figure 16. Mic Preamplifier Total Harmonic Distortion + Noise vs Frequency
Fig18_EVM1_MicpreampFrequencyResponse_24dB.gif
MIC VDD = 3.0 V Gain = 24 dB
Figure 18. Mic Preamplifier Frequency Response
Fig20_EVM2_Micpreamp_outputSpectrum_12dB.gif
MIC VDD = 3.0 V Gain = 12 dB No signal input
Figure 20. Mic Preamplifier + Micbias Output Frequency Spectrum