SNAS806 September   2020 TPL1401

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Standard Mode
    7. 6.7  Timing Requirements: I2C Fast Mode
    8. 6.8  Timing Requirements: I2C Fast Mode Plus
    9. 6.9  Typical Characteristics: VDD = 1.8 V (Reference = VDD) or VDD = 2 V (Internal Reference)
    10. 6.10 Typical Characteristics: VDD = 5.5 V (Reference = VDD) or VDD = 5 V (Internal Reference)
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Potentiometer (Digipot) Architecture
        1. 7.3.1.1 Reference Selection and Digipot Transfer Function
          1. 7.3.1.1.1 Power Supply as Reference
          2. 7.3.1.1.2 Internal Reference
      2. 7.3.2 Digipot Update
      3. 7.3.3 Nonvolatile Memory (EEPROM or NVM)
        1. 7.3.3.1 NVM Cyclic Redundancy Check
          1. 7.3.3.1.1 NVM_CRC_ALARM_USER Bit
          2. 7.3.3.1.2 NVM_CRC_ALARM_INTERNAL Bit
      4. 7.3.4 Power-On Reset (POR)
      5. 7.3.5 Software Reset
      6. 7.3.6 Device Lock Feature
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down Mode
    5. 7.5 Programming
      1. 7.5.1 F/S Mode Protocol
      2. 7.5.2 I2C Update Sequence
      3. 7.5.3 Address Byte
      4. 7.5.4 Command Byte
      5. 7.5.5 I2C Read Sequence
    6. 7.6 Register Map
      1. 7.6.1 STATUS Register (address = D0h) (reset = 000Ch or 0014h)
      2. 7.6.2 GENERAL_CONFIG Register (address = D1h) (reset = 01F0h)
      3. 7.6.3 PROTECT Register (address = D3h) (reset = 0008h)
      4. 7.6.4 DPOT_POSITION Register (address = 21h) (reset = 0000h)
      5. 7.6.5 USER_BYTE1 Register (address = 25h) (reset = 0000h)
      6. 7.6.6 USER_BYTE2 Register (address = 26h) (reset = 0000h)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.