SLVSEG3E September   2019  – March 2022 TPS25840-Q1 , TPS25842-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Buck Regulator
      2. 10.3.2  Enable/UVLO
      3. 10.3.3  Switching Frequency and Synchronization (RT/SYNC)
      4. 10.3.4  Spread-Spectrum Operation
      5. 10.3.5  VCC, VCC_UVLO
      6. 10.3.6  Minimum ON-time, Minimum OFF-time
      7. 10.3.7  Internal Compensation
      8. 10.3.8  Bootstrap Voltage (BOOT)
      9. 10.3.9  RSNS, RSET, RILIMIT and RIMON
      10. 10.3.10 Overcurrent and Short Circuit Protection
        1. 10.3.10.1 Current Limit Setting using RILIMIT
        2. 10.3.10.2 Buck Average Current Limit Design Example
        3. 10.3.10.3 External MOSFET Gate Drivers
        4. 10.3.10.4 Cycle-by-Cycle Buck Current Limit
      11. 10.3.11 Overvoltage, IEC and Short-to-Battery Protection
        1. 10.3.11.1 V BUS and V CSN/OUT Overvoltage Protection
        2. 10.3.11.2 DP_IN and DM_IN Protection
      12. 10.3.12 Cable Compensation
        1. 10.3.12.1 Cable Compensation Design Example
      13. 10.3.13 USB Port Control
      14. 10.3.14 FAULT Response
      15. 10.3.15 USB Specification Overview
      16. 10.3.16 Device Power Pins (IN, CSN/OUT, and PGND)
      17. 10.3.17 Thermal Shutdown
    4. 10.4 Device Functional Modes
      1. 10.4.1 Shutdown Mode
      2. 10.4.2 Active Mode
      3. 10.4.3 Device Truth Table (TT)
      4. 10.4.4 USB Port Operating Modes
        1. 10.4.4.1 Standard Downstream Port (SDP) Mode — USB 2.0, USB 3.0, and USB 3.1
        2. 10.4.4.2 Charging Downstream Port (CDP) Mode
        3. 10.4.4.3 Client Mode
      5. 10.4.5 High-bandwidth Data-line Switches
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1  Output Voltage
        2. 11.2.2.2  Switching Frequency
        3. 11.2.2.3  Inductor Selection
        4. 11.2.2.4  Output Capacitor Selection
        5. 11.2.2.5  Input Capacitor Selection
        6. 11.2.2.6  Bootstrap Capacitor Selection
        7. 11.2.2.7  VCC Capacitor Selection
        8. 11.2.2.8  Enable and Under Voltage Lockout Set-Point
        9. 11.2.2.9  Current Limit Set-Point
        10. 11.2.2.10 Cable Compensation Set-Point
        11. 11.2.2.11 FAULT Resistor Selection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Ground Plane and Thermal Considerations
    3. 13.3 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Documentation Support
      1. 14.1.1 Related Documentation
    2. 14.2 Related Links
    3. 14.3 Receiving Notification of Documentation Updates
    4. 14.4 Support Resources
    5. 14.5 Trademarks
    6. 14.6 Electrostatic Discharge Caution
    7. 14.7 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Absolute Maximum Ratings

Voltages are with respect to GND (unless otherwise noted)(1)
PARAMETERMINMAXUNIT
Input voltageIN to PGND–0.340V
OUT to PGND–0.320
EN to AGND–0.3VIN + 0.3
CSP to AGND–0.320
CSN to AGND–0.320
BUS to AGND–0.318
RT/SYNC to AGND–0.36
CTRL1 or CTRL2 to AGND–0.36
AGND to PGND–0.30.3
Output voltageSW to PGND–0.3VIN + 0.3V
SW to PGND (less than 10 ns transients)–3.540
BOOT to SW–0.36
VCC to AGND–0.36
LS_GD–0.318
Voltage rangeTPS25840-Q1: DP_IN, DM_IN to AGND–0.318V
TPS25842-Q1: DP_IN, DM_IN to AGND–0.37
DP_OUT, DM_OUT to AGND–0.36
FAULT, BUCK_ST, INT to AGND–0.36
ILIMIT or IMON to AGND–0.36
Pin positive source current, IVCCVCC Source Current5mA
Pin positive sink current, ISNKFAULT, BUCK_STInternally LimitedA
I/O currentDP_IN to DP_OUT, or DM_IN to DM_OUT in SDP, CDP, or Client Mode–100100mA
TJJunction temperature-40150°C
TstgStorage temperature–65150°C
(1) Stresses beyond those listed under Absolute Maximum Rating can cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.