SLVSDG2G July   2016  – December  2019 TPS2660

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Schematic
  3. 3 Description
    1.     Reverse Input Polarity Protection at –60-V Supply
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Undervoltage Lockout (UVLO)
      2. 9.3.2 Overvoltage Protection (OVP)
      3. 9.3.3 Reverse Input Supply Protection
      4. 9.3.4 Hot Plug-In and In-Rush Current Control
      5. 9.3.5 Overload and Short Circuit Protection
        1. 9.3.5.1 Overload Protection
          1. 9.3.5.1.1 Active Current Limiting
          2. 9.3.5.1.2 Electronic Circuit Breaker with Overload Timeout, MODE = OPEN
        2. 9.3.5.2 Short Circuit Protection
          1. 9.3.5.2.1 Start-Up With Short-Circuit On Output
        3. 9.3.5.3 FAULT Response
          1. 9.3.5.3.1 Look Ahead Overload Current Fault Indicator
        4. 9.3.5.4 Current Monitoring
        5. 9.3.5.5 IN, OUT, RTN, and GND Pins
        6. 9.3.5.6 Thermal Shutdown
        7. 9.3.5.7 Low Current Shutdown Control (SHDN)
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Step by Step Design Procedure
        2. 10.2.2.2 Programming the Current-Limit Threshold—R(ILIM) Selection
        3. 10.2.2.3 Undervoltage Lockout and Overvoltage Set Point
        4. 10.2.2.4 Programming Current Monitoring Resistor—RIMON
        5. 10.2.2.5 Setting Output Voltage Ramp Time—(tdVdT)
          1. 10.2.2.5.1 Case 1: Start-Up Without Load—Only Output Capacitance C(OUT) Draws Current During Start-Up
          2. 10.2.2.5.2 Case 2: Start-Up With Load—Output Capacitance C(OUT) and Load Draws Current During Start-Up
          3. 10.2.2.5.3 Support Component Selections—RFLTb and C(IN)
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Acive ORing Operation
      2. 10.3.2 Field Supply Protection in PLC, DCS I/O Modules
      3. 10.3.3 Simple 24-V Power Supply Path Protection
    4. 10.4 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Transient Protection
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHF|24
  • PWP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.5.3 FAULT Response

The FLT open-drain output asserts (active low) under following conditions:

  • Fault events such as undervoltage, overvoltage, over load, reverse current and thermal shutdown conditions
  • When the device enters low current shutdown mode when SHDN is pulled low
  • During start-up when the internal FET GATE is not fully enhanced
The device is designed to eliminate false reporting by using an internal "de-glitch" circuit for fault conditions without the need for an external circuitry.

The FLT signal can also be used as Power Good indicator to the downstream loads like DC-DC converters. An internal Power Good (PGOOD) signal is OR'd with the fault logic. During start-up, when the device is operating in dVdT mode, PGOOD and FLT remains low and is de-asserted after the dVdT mode is completed and the internal FET is fully enhanced. The PGOOD signal has deglitch time incorporated to ensure that internal FET is fully enhanced before heavy load is applied by the downstream converters. Rising deglitch delay is determined by tPGOOD(degl) = Maximum {(875 + 20 × C(dVdT)), tPGOODR}, where C(dVdT) is in nF and tPGOOD(degl) is in µs. FLT can be left open or connected to RTN when not used. V(IN) falling below V(PORF) = 3.72 V resets FLT.

In case of reverse input polarity fault, care should be taken while interfacing FLT pin to the downstream I/O. Refer to the application report, Fault Handling Using TPS2660 eFuse for further information.