SLVSE94F September   2018  – June 2021 TPS2663

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Hot Plug-In and In-Rush Current Control
        1. 9.3.1.1 Thermal Regulation Loop
      2. 9.3.2  PGOOD and PGTH
        1. 9.3.2.1 PGTH as VOUT Sensing Input
      3. 9.3.3  Undervoltage Lockout (UVLO)
      4. 9.3.4  Overvoltage Protection (OVP)
      5. 9.3.5  Input Reverse Polarity Protection (B_GATE, DRV)
      6. 9.3.6  Reverse Current Protection
      7. 9.3.7  Overload and Short Circuit Protection
        1. 9.3.7.1 Overload Protection
          1. 9.3.7.1.1 Active Current Limiting at 1x IOL, (TPS26630 and TPS26632 Only)
          2. 9.3.7.1.2 Active Current Limiting with 2x IOL Pulse Current Support, (TPS26631, TPS26633, TPS26635 and TPS26636 Only)
        2. 9.3.7.2 Short Circuit Protection
          1. 9.3.7.2.1 Start-Up With Short-Circuit On Output
      8. 9.3.8  Output Power Limiting, PLIM (TPS26632, TPS26633, TPS26635 and TPS26636 Only)
      9. 9.3.9  Current Monitoring Output (IMON)
      10. 9.3.10 FAULT Response ( FLT)
      11. 9.3.11 IN_SYS, IN, OUT and GND Pins
      12. 9.3.12 Thermal Shutdown
      13. 9.3.13 Low Current Shutdown Control (SHDN)
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application: Power Path Protection in a PLC System
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Programming the Current-Limit Threshold—R(ILIM) Selection
        2. 10.2.2.2 Undervoltage Lockout and Overvoltage Set Point
        3. 10.2.2.3 Output Buffer Capacitor – COUT
        4. 10.2.2.4 PGTH Set Point
        5. 10.2.2.5 Setting Output Voltage Ramp Time—(tdVdT)
          1. 10.2.2.5.1 Support Component Selections— RPGOOD and C(IN)
        6. 10.2.2.6 Selecting Q1, Q2 and TVS Clamp for Surge Protection
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Simple 24-V Power Supply Path Protection
      2. 10.3.2 Priority Power MUX Operation
      3. 10.3.3 Input Protection for a Compact 24-V Auxiliary Power Supply for Servo Drives
    4. 10.4 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Transient Protection
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
  • PWP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Transient Protection

In case of short circuit and overload current limit, when the device interrupts current flow, input inductance generates a positive voltage spike on the input and output inductance generates a negative voltage spike on the output. The peak amplitude of voltage spikes (transients) depends on the value of inductance in series to the input or output of the device. These transients can exceed the Absolute Maximum Ratings of the device if steps are not taken to address the issue.

Typical methods for addressing transients include:

  • Minimizing lead length and inductance into and out of the device
  • Using large PCB GND plane
  • Use of a Schottky diode across the output and GND to absorb negative spikes
  • A low value ceramic capacitor (C(IN) to approximately 0.1 μF) to absorb the energy and dampen the transients.

The approximate value of input capacitance can be estimated with Equation 14

Equation 14. GUID-69E8BDAD-05FE-4765-9A22-158EFC2178B0-low.gif

where

  • V(IN) is the nominal supply voltage
  • I(LOAD) is the load current
  • L(IN) equals the effective inductance seen looking into the source
  • C(IN) is the capacitance present at the input

Some applications may require additional Transient Voltage Suppressor (TVS) to prevent transients from exceeding the Absolute Maximum Ratings of the device. These transients can occur during positive and negative surge tests on the supply lines. In such applications it is recommended to place at least 1 µF of input capacitor.

The circuit implementation with optional protection components (a ceramic capacitor, TVS and schottky diode) is shown in Figure 10-1.

GUID-65805987-889D-458C-9CF2-2E27936764E0-low.gif
* Optional components needed for suppression of transients
Figure 11-1 Circuit Implementation with Optional Protection Components for TPS2663x