SLVS227F August   1999  – December 2020

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Device Comparison
  6. 6Pin Configuration and Functions
  7. 7Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings for TPS3123
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Dissipation Rating Table
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Diagrams
    9. 7.9 Typical Characteristics
  8. 8Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Manual Reset ( MR)
      2. 8.3.2 Active-High or Active-Low Output
      3. 8.3.3 Push-Pull or Open-Drain Output
      4. 8.3.4 Watchdog Timer (WDI)
    4. 8.4 Device Functional Modes
  9. 9Device and Documentation Support

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
UNIT
Manual reset, MR–0.3 V to VDD + 0.6 V
RESET–0.3 V to VDD + 0.6 V
VDDSupply voltage3.6 V
WDIWatchdog input–0.3 V to VDD + 0.6 V
IOLMaximum low output current5 mA
IOHMaximum high output current–5 mA
IIKInput clamp current (VI < 0 or VI > VDD)±10 mA
IOKOutput clamp current (VO < 0 or VO > VDD)±10 mA
Continuous total power dissipationSee Dissipation Rating Table
TAOperating free-air temperature range,–40°C to +85°C
TstgStorage temperature range,–65°C to +150°C
Soldering temperature+260°C
Open drain RESET outputs–0.3 V to VDD + 0.3 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.