SLUSEE8 September   2022 TPS51383

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  PWM Operation and D-CAP3 Control Mode
      2. 7.3.2  VCC LDO
      3. 7.3.3  Soft Start
      4. 7.3.4  Enable Control
      5. 7.3.5  Power Good
      6. 7.3.6  Overcurrent Protection and Undervoltage Protection
      7. 7.3.7  100-mA LDO with Switch Over
      8. 7.3.8  UVLO Protection
      9. 7.3.9  Overvoltage Protection
      10. 7.3.10 Output Voltage Discharge
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 MODE Pin
      2. 7.4.2 Out-Of-Audio™ Mode
      3. 7.4.3 Power Save Mode (PSM)
  8. 8  Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Component Selection
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Output Capacitor Selection
          3. 8.2.2.1.3 Input Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

  • Recommend a four-layer PCB for good thermal performance and with maximum ground plane.
  • Recommend having a small bypass capacitor on VIN side of the IC. Place the capacitor as close to IC as possible.
  • FB and VOUT traces must be routed away from the noisy switch node.
  • VIN and VOUT traces must be wide to reduce the trace impedance.