SLVSDQ7B October   2016  – July 2021 TPS57114C-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fixed-Frequency PWM Control
      2. 7.3.2 Slope Compensation and Output Current
      3. 7.3.3 Bootstrap Voltage (BOOT) and Low-Dropout Operation
        1. 7.3.3.1 Error Amplifier
      4. 7.3.4 Voltage Reference
    4. 7.4 Device Functional Modes
      1. 7.4.1  Adjusting the Output Voltage
      2. 7.4.2  Enable Functionality and Adjusting Undervoltage Lockout
      3. 7.4.3  Slow-Start or Tracking Pin
      4. 7.4.4  Sequencing
      5. 7.4.5  Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      6. 7.4.6  Overcurrent Protection
      7. 7.4.7  Frequency Shift
      8. 7.4.8  Reverse Overcurrent Protection
      9. 7.4.9  Synchronize Using The RT/CLK Pin
      10. 7.4.10 Power Good (PWRGD Pin)
      11. 7.4.11 Overvoltage Transient Protection
      12. 7.4.12 Thermal Shutdown
      13. 7.4.13 Small-Signal Model for Loop Response
      14. 7.4.14 Simple Small-Signal Model for Peak-Current Mode Control
      15. 7.4.15 Small-Signal Model for Frequency Compensation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Selecting the Switching Frequency
        2. 8.2.2.2 Output Inductor Selection
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Input Capacitor
        5. 8.2.2.5 Slow-Start Capacitor
        6. 8.2.2.6 Bootstrap Capacitor Selection
        7. 8.2.2.7 Output-Voltage And Feedback-Resistor Selection
        8. 8.2.2.8 Compensation
        9. 8.2.2.9 Power-Dissipation Estimate
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.12 Thermal Shutdown

The device implements an internal thermal shutdown to protect itself if the junction temperature exceeds 168°C. The thermal shutdown forces the device to stop switching when the junction temperature exceeds the thermal trip threshold. Once the die temperature decreases below 148°C, the device reinitiates the power-up sequence by discharging the SS pin to below 60 mV. The thermal shutdown hysteresis is 20°C.