SLVS203F June   1999  – January 2025 TPS769

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information (New Chip)
    5. 5.5 Thermal Information (Legacy Chip)
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
    8. 5.8 Typical Characteristics: Supported ESR Range
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Adjustable Device Feedback Resistors
        2. 7.2.2.2 Recommended Capacitor Types
        3. 7.2.2.3 Input and Output Capacitor Requirements
        4. 7.2.2.4 Reverse Current
        5. 7.2.2.5 Feed-Forward Capacitor (CFF)
        6. 7.2.2.6 Power Dissipation (PD)
        7. 7.2.2.7 Estimating Junction Temperature
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Module
        2. 8.1.1.2 Spice Models
        3. 8.1.1.3 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application Curves

TPS769 Power-Up Waveform (Legacy Chip)
Channel 1 = VOUT, channel 2 = VIN, channel 4 = IOUT
Figure 7-4 Power-Up Waveform (Legacy Chip)
TPS769 LDO
                        Start-Up Time With Input supply (New Chip)
 
Figure 7-6 LDO Start-Up Time With Input supply (New Chip)
TPS769 TPS76915 Line Transient Response (Legacy Chip)
 
Figure 7-8 TPS76915 Line Transient Response (Legacy Chip)
TPS769 TPS76933 Line Transient Response (Legacy Chip)
 
Figure 7-10 TPS76933 Line Transient Response (Legacy Chip)
TPS769 TPS76933 Line Transient Response (New Chip)
4.3V to 16.0V at 1V/μs
Figure 7-12 TPS76933 Line Transient Response (New Chip)
TPS769 TPS76933 Load Transient Response (New Chip)
1mA to 100mA at 1A/μs
Figure 7-14 TPS76933 Load Transient Response (New Chip)
TPS769 TPS76933 Load Transient Response (New Chip)
1mA to 100mA at 1mA/μs
Figure 7-16 TPS76933 Load Transient Response (New Chip)
TPS769 Pow
Channel 1 = VOUT, channel 2 = VIN, channel 4 = IOUT
Figure 7-5 Pow
TPS769 LDO
                        Start-Up Time With EN (New Chip)
 
Figure 7-7 LDO Start-Up Time With EN (New Chip)
TPS769 TPS76915 Load Transient Response (Legacy Chip)
 
Figure 7-9 TPS76915 Load Transient Response (Legacy Chip)
TPS769 TPS76933 Line Transient Response (New Chip)
4.3V to 5.3V at 1V/μs
Figure 7-11 TPS76933 Line Transient Response (New Chip)
TPS769 TPS76933 Load Transient Response (Legacy Chip)
 
Figure 7-13 TPS76933 Load Transient Response (Legacy Chip)
TPS769 TPS76933 Load Transient Response (New Chip)
1μA to 100mA at 1A/μs
Figure 7-15 TPS76933 Load Transient Response (New Chip)