SBVS362D June   2020  – October 2025 TPS7B86-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Enable (EN)
      2. 6.3.2 Power-Good (PG)
      3. 6.3.3 Adjustable Power-Good Delay Timer (DELAY)
      4. 6.3.4 Undervoltage Lockout
      5. 6.3.5 Thermal Shutdown
      6. 6.3.6 Current Limit
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input and Output Capacitor Selection
      2. 7.1.2 Adjustable Device Feedback Resistor Selection
      3. 7.1.3 Feed-Forward Capacitor
      4. 7.1.4 Dropout Voltage
      5. 7.1.5 Reverse Current
      6. 7.1.6 Power Dissipation (PD)
        1. 7.1.6.1 Thermal Performance Versus Copper Area
        2. 7.1.6.2 Power Dissipation Versus Ambient Temperature
      7. 7.1.7 Estimating Junction Temperature
      8. 7.1.8 Power-Good
        1. 7.1.8.1 Setting the Adjustable Power-Good Delay
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Capacitor
        2. 7.2.2.2 Output Capacitor
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package Mounting
        2. 7.4.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDA|8
  • KVU|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1.1 Device Nomenclature

Table 8-1 Device Nomenclature(1)
PRODUCT VOUT
TPS7B86xxzQyyyRQ1 xx is the nominal output voltage (for example, 33 = 3.3V; 50 = 5.0V; 01 = adjustable).
z indicates the version of the device. No letter here indicates a device without power-good. B indicates a device with power-good. D also indicates a device with power-good and is only a pinout variant of the B version.
yyy is the package designator.
Q indicates that this device is a grade-1 device in accordance with the AEC-Q100 standard.
Q1 indicates that this device is an automotive grade (AEC-Q100) device.

For the DDA package, this device potentially ships with multiple leadframes. The reel packaging label provides ASO information to distinguish which leadframe is used. ASO : FMX label denotes material from the new manufacturing site and ASO : ASE label denotes material from the legacy manufacturing site.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the device product folder on www.ti.com.