SNVSCE7D January   2024  – July 2025 TPS7H3014-SEP , TPS7H3014-SP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Quality Conformance Inspection
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Voltage (IN), VLDO and REFCAP
        1. 8.3.1.1 Undervoltage Lockout (VPOR_IN < VIN < UVLO)
        2. 8.3.1.2 Power-On Reset (VIN < VPOR_IN )
      2. 8.3.2 SENSEx Inputs
        1. 8.3.2.1 VTH_SENSEX and VONx
        2. 8.3.2.2 IHYS_SENSEx and VOFFx
        3. 8.3.2.3 Top and Bottom Resistive Divider Design Equations
      3. 8.3.3 Output Stages (ENx,SEQ_DONE,PWRGD,PULL_UP1 and PULL_UP2)
      4. 8.3.4 User-Programmable TIMERS
        1. 8.3.4.1 DLY_TMR
        2. 8.3.4.2 REG_TMR
      5. 8.3.5 UP and DOWN
      6. 8.3.6 FAULT
      7. 8.3.7 State Machine
    4. 8.4 Daisy Chain
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Self Contained – Sequence UP and DOWN
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Input Power Supplies and Decoupling Capacitors
          2. 9.2.1.2.2 UP and DOWN Thresholds
          3. 9.2.1.2.3 SENSEx Thresholds
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Sequencing of Negative Voltage Rails
        1. 9.2.2.1 Negative Voltage Design Equations
    3. 9.3 Externally Induced System RESET
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.5.1 Layout Guidelines

  • Make sure that the connection to the VIN pin is low impedance. Place a greater than 1µF ceramic capacitor as near as possible to the VIN pin.
  • Make sure that the connection to the VPULL_UP1 and VPULL_UP2 pins are low impedance. Place a greater than 1µF ceramic capacitor as near as possible to the pins.
  • If needed, place a small capacitor between the SENSEx pins and GND to reduce the sensitivity to transient voltages on the monitored signal.