SLOSEG4 August   2025 TRF1305C2

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - AC Specifications in D2D Configuration
    6. 6.6 Electrical Characteristics - AC Specifications in S2D Configuration
    7. 6.7 Electrical Characteristics - DC and Timing Specifications
    8. 6.8 Typical Characteristics: D2D Configuration
    9. 6.9 Typical Characteristics: S2D Configuration
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fully Differential RF Amplifier
      2. 7.3.2 Output Common-Mode Control
      3. 7.3.3 Internal Resistor Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 MODE Pin
        1. 7.4.1.1 Input Common-Mode Extension
      2. 7.4.2 Power-Down Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input and Output Interface Considerations
        1. 8.1.1.1 Single-Ended Input
        2. 8.1.1.2 Differential Input
        3. 8.1.1.3 DC-Coupling Considerations
      2. 8.1.2 Gain Adjustment With External Resistors in a Differential Input Configuration
    2. 8.2 Typical Application
      1. 8.2.1 TRF1305C2 as ADC Driver in a Zero-IF Receiver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Supply Voltages
      2. 8.3.2 Single-Supply Operation
      3. 8.3.3 Split-Supply Operation
      4. 8.3.4 Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Thermal Considerations
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RYP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Electrical Characteristics - AC Specifications in S2D Configuration

at TA = 25℃, VS+ = 5V, VS– = 0V, floating VOCM, PD, and MODE pins, VICM = mid-supply, S2D ac-coupled input/output configuration with RTERM = 50Ω, ZS = 50Ω, ZL = 100Ω (see Figure 8-1), and input and outputs de-embedded up to the device pins (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AC PERFORMANCE
SSBW Small-signal bandwidth (3dB) PIN = –20dBm at each input 6.8 GHz
Small-signal bandwidth (1dB) PIN = –20dBm at each input 5.2
LSBW Large-signal bandwidth (3dB) Single-ended PIN = 2dBm 6.6 GHz
Large-signal bandwidth (1dB) Single-ended PIN = 2dBm 4.9
Sds21 Power gain f = 500MHz 5.2 dB
f = 4GHz 5
Gain variation over temperature f = 4GHz, TA = –40℃ to +85℃ 1.5 dB
Sss11 Input return loss f = 10MHz to 5GHz –12 dB
Ssd12 Reverse isolation f < 5GHz (device enabled) –22 dB
Gain mismatch between channels f = 10MHz to 5GHz ±0.25 dB
Phase mismatch between channels f = 10MHz to 5GHz ±2 °
Crosstalk between channels f = 1GHz –46 dBc
GIMB Differential output gain imbalance f < 5GHz, PIN = –20dBm with 50Ω ZS ±0.8 dB
PHIMB Differential output phase imbalance f < 5GHz, PIN = –20dBm with 50Ω ZS ±1.5 °
OP1dB Output 1dB compression point f = 500MHz 14.8 dBm
f = 1GHz 15
f = 2GHz 14.5
f = 3GHz 13.1
f = 4GHz 11.4
f = 5GHz 10
HD2 Second-order harmonic distortion VO = 2VPP (PO = 7dBm) f = 500MHz –63 dBc
f = 1GHz –50
f = 2GHz –41
f = 3GHz –30
f = 4GHz –29
HD3 Third-order harmonic distortion VO = 2VPP (PO = 7dBm) f = 500MHz –67 dBc
f = 1GHz –55
f = 2GHz –44
f = 3GHz –44
f = 4GHz –50
OIP2 Output second-order intercept point PO = 1dBm per tone,
2MHz spacing		 f = 500MHz 71 dBm
f = 1GHz 55
f = 2GHz 43
f = 3GHz 34
f = 4GHz 31
f = 5GHz 34
OIP3 Output third-order intercept point PO = 1dBm per tone,
2MHz spacing		 f = 500MHz 39.5 dBm
f = 1GHz 35.5
f = 2GHz 30.5
f = 3GHz 25.5
f = 4GHz 21
f = 5GHz 17.5
NF Noise figure f = 500MHz 12.2 dB
f = 1GHz 12.5
f = 2GHz 13.8
f = 3GHz 15.7
f = 4GHz 16.9
f = 5GHz 17.4
NSD Output noise spectral density f = 500MHz –156.7 dBm/Hz
f = 1GHz –156.2
f = 2GHz –155
f = 3GHz –153.3
f = 4GHz –152.2
f = 5GHz –151.7