SLWS245B May   2014  – February 2017 TRF3722

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Typical Characteristics
      1. 6.6.1 Modulator Output Spectrum
    7. 6.7  Typical Characteristics - Output Power
    8. 6.8  Typical Characteristics - Gain
    9. 6.9  Typical Characteristics - OIP3
    10. 6.10 Typical Characteristics - OIP2
    11. 6.11 Typical Characteristics - OP1dB
    12. 6.12 Typical Characteristics - Noise
    13. 6.13 Typical Characteristics - Unadjusted CF
    14. 6.14 Typical Characteristics - Unadjusted SBS
    15. 6.15 Typical Characteristics - LO Harmonic
    16. 6.16 Typical Characteristics - BB Harmonic
    17. 6.17 Typical Characteristics - RF Output Return Loss
    18. 6.18 Typical Characteristics - PLL/VCO
    19. 6.19 Typical Characteristics - Current Consumption
    20. 6.20 Typical Characteristics - Power Dissipation
  7. 7 Parameter Measurement Information
    1. 7.1 Serial Interface Timing Diagram
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 RF Output
      2. 8.3.2 Baseband Inputs
      3. 8.3.3 LO Output
      4. 8.3.4 PLL Architecture
      5. 8.3.5 External VCO
      6. 8.3.6 Loop Filter
      7. 8.3.7 Lock Detect
    4. 8.4 Device Functional Modes
      1. 8.4.1 Selecting PLL Divider Values
      2. 8.4.2 Setup Example for Integer Mode
      3. 8.4.3 Integer and Fractional Mode Selection
      4. 8.4.4 Selecting the VCO and VCO Frequency Control
    5. 8.5 Register Maps
      1. 8.5.1 Serial interface Register Definition
        1. 8.5.1.1 BIAS SETTINGS
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures: DAC to Modulator Interface Network
      3. 9.2.3 Application Curves: DAC34H84 with TRF3722 Modulator Performance
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.