SCDS358B November   2014  – February 2015 TS3A227E

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Characteristics
    7. 7.7 Timing Diagrams
      1. 7.7.1 Removal
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Accessory Configuration Detection
      2. 9.3.2 Optional Manual I2C Control
      3. 9.3.3 Adjustable De-bounce Timings
      4. 9.3.4 Key Press Detection
      5. 9.3.5 Click Pop Noise Reduction
      6. 9.3.6 Power off Noise Removal
      7. 9.3.7 Sleep Mode
      8. 9.3.8 Codec Sense Line
      9. 9.3.9 FM Support
    4. 9.4 Device Functional Modes
      1. 9.4.1 Sleep Mode
      2. 9.4.2 Manual Switch Control
      3. 9.4.3 Manual Switch Control Use Cases
      4. 9.4.4 FM Support Mode
    5. 9.5 Register Maps
    6. 9.6 Register Field Descriptions
      1. 9.6.1  Device ID Register Field Descriptions (Address 00h)
      2. 9.6.2  Interrupt Register Field Descriptions (Address 01h)
      3. 9.6.3  Key Press Interrupt Register Field Descriptions (Address 02h)
      4. 9.6.4  Interrupt Disable Register Field Descriptions (Address 03h)
      5. 9.6.5  Device Settings Field Descriptions (Address 04h)
      6. 9.6.6  Key Press Settings 1 Field Descriptions (Address 05h)
      7. 9.6.7  Key Press Settings 2 Field Descriptions (Address 06h)
      8. 9.6.8  Switch Control 1 Field Descriptions (Address 07h)
      9. 9.6.9  Switch Control 2 Field Descriptions (Address 08h)
      10. 9.6.10 Switch Status 1 Field Descriptions (Address 09h)
      11. 9.6.11 Switch Status 2 Field Descriptions (Address 0Ah)
      12. 9.6.12 Detection Results Field Descriptions (Address 0Bh)
      13. 9.6.13 ADC Output Field Descriptions (Address 0Ch)
      14. 9.6.14 Threshold 1 Field Descriptions (Address 0Dh)
      15. 9.6.15 Threshold 2 Field Descriptions (Address 0Eh)
      16. 9.6.16 Threshold 3 Field Descriptions (Address 0Fh)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Standard I2C Interface Details
        2. 10.2.1.2 Write Operations
        3. 10.2.1.3 Read Operations
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Accessory Insertion
        2. 10.2.2.2 Audio Jack Selection
        3. 10.2.2.3 Switch Status
          1. 10.2.2.3.1 Switch Status Diagrams
        4. 10.2.2.4 Key Press Detection
          1. 10.2.2.4.1 Key Press Thresholds
          2. 10.2.2.4.2 System Requirements
          3. 10.2.2.4.3 Key Press Grey Zones
          4. 10.2.2.4.4 Behavior
          5. 10.2.2.4.5 Single Key Press Timing
          6. 10.2.2.4.6 Multiple Key Press Timing
          7. 10.2.2.4.7 Raw Data Key Press Detection
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example (QFN)
    3. 12.3 Layout Example (DSBGA)
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from A Revision (December 2014) to B Revision

  • Added DSBGA package to the Thermal Information table. Go
  • Updated SWITCH RESISTANCE for the DSBGA package. Go

Changes from * Revision (July 2014) to A Revision

  • Initial release of full version document. Go