The TS3A227E is an autonomous audio accessory detection and configuration switch that detects 3-pole or 4-pole audio accessories and configures internal switches to route the signals accordingly.
The internal ground FETS of the TS3A227E have an ultra-low RON of 60 mΩ to minimize crosstalk impact. The ground FETs are also designed to pass FM signals, making it possible to use the ground line of the accessory as an FM antenna in mobile audio applications.
Internal isolation switches allow the TS3A227E to remove the click/pop noise that can be generated during and insertion or removal of an audio accessory. In addition depletion FETs prevent a floating ground while the device is unpowered, removing the humming noise present when leaving accessories plugged into an unpowered system.
A low-power sleep mode is provided which shuts down internal circuitry to achieve very low quiescent current draw when no headset is inserted.
The TS3A227E features integrated key press detection for detecting up to 4 keys with press and release support.
Manual I2C control allows the TS3A227E to adapt to application needs by providing control over de-bounce settings and switch states.
| Top documentation | Type | Title | Format options | Date |
|---|---|---|---|---|
| * | Data sheet | TS3A227E Autonomous Audio Accessory Detection and Configuration Switch datasheet (Rev. B) | PDF | HTML | Feb 5, 2015 |
| Application note | Support Selfie Sticks Using a TS3A227E Audio Jack Switch | Mar 4, 2016 |
For additional terms or required resources, click any title below to view the detail page where available.
The TS3A227E-EVM is an evaluation module for TI’s autonomous audio-accessory switch with adjustable debounce settings, ultralow RON ground FETs, depletion FETs, key-press detection and manual I2C control. The module lets you easily evaluate the device performance and functionality. (...)
The Linux driver supports the TS3A227E Autonomous Audio Accessory Detection and Configuration Switch. The Linux driver supports communication through the I2C bus and interfaces with the Linux Sound SoC Component framework.
Available in Linux Main line: Yes
Available through (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| DSBGA (YFF) | 16 | Ultra Librarian |
| VQFN (RVA) | 16 | Ultra Librarian |
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