SLLSF63B March   2018  – October 2023 TUSB1002A

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Control Inputs
      2. 7.3.2 Linear Equalization
      3. 7.3.3 Adjustable VOD Linear Range and DC Gain
      4. 7.3.4 USB3.2 Dual Channel Operation (MODE = “F”)
      5. 7.3.5 USB3.2 Single Channel Operation (MODE = “1”)
      6. 7.3.6 PCIe/SATA/SATA Express Redriver Operation (MODE = “R”; CFG1 = "0"; CFG2 = "0" )
      7. 7.3.7 Basic Redriver Operation (MODE = “0”)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Disconnect Mode
    5. 7.5 U0 Mode
    6. 7.6 U1 Mode
    7. 7.7 U2/U3 Mode
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical USB3.2 Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 ESD Protection
      4. 8.2.4 Application Curves
    3. 8.3 Typical SATA, PCIe and SATA Express Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Supports USB3.2 x1 SuperSpeed (5 Gbps) and SuperSpeedPlus (10 Gbps)
  • Supports PCI express Gen3, SATA express, and SATA Gen3
  • Ultra low-power architecture:
    • Disconnect U2, U3: < 1.9 mW
    • Shutdown: < 700 µW
  • Adjustable voltage output swing linear range up to 1200 mVpp
  • No host or device side requirement
  • 16 settings for up to 16 dB at 10 Gbps of linear equalization
  • Adjustable DC equalization gain
  • Hot-plug capable
  • Pin-to-pin compatible with LVPE502A and LVPE512 USB 3.0 redriver
  • Pin-to-pin compatible with TUSB1002 redriver
  • Temperature range: 0°C to 70°C (commercial) and –40°C to 85°C (industrial)
  • ±5 kV HBM ESD
  • Available in single 3.3-V supply.
  • Available in 4 mm × 4 mm VQFN