SLLSEE5D february   2013  – july 2023 TUSB8040A1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings #GUID-9FC00080-214A-41B8-A47D-B9F7BA87DE22/SLLSE42922
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 3.3-V I/O Electrical Characteristics
    6. 6.6 Hub Input Supply Current
    7. 6.7 Timing and Switching Characteristics
      1. 6.7.1 Clock Generation
      2. 6.7.2 Crystal Requirements
      3. 6.7.3 Input Clock Requirements
  8. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Memory
    4. 7.4 I2C EEPROM Operation
    5. 7.5 SMBus Target Operation
    6. 7.6 Configuration Registers
      1. 7.6.1  ROM Signature Register
      2. 7.6.2  Vendor ID LSB Register
      3. 7.6.3  Vendor ID MSB Register
      4. 7.6.4  Product ID LSB Register
      5. 7.6.5  Product ID MSB Register
      6. 7.6.6  Device Configuration Register
      7. 7.6.7  Battery Charging Support Register
      8. 7.6.8  Device Removable Configuration Register
      9. 7.6.9  Port Used Configuration Register
      10. 7.6.10 Reserved Register
      11. 7.6.11 Reserved Register
      12. 7.6.12 Language ID LSB Register
      13. 7.6.13 Language ID MSB Register
      14. 7.6.14 Serial Number String Length Register
      15. 7.6.15 Manufacturer String Length Register
      16. 7.6.16 Product String Length Register
      17. 7.6.17 Reserved Register
      18. 7.6.18 Serial Number Registers
      19. 7.6.19 Manufacturer String Registers
      20. 7.6.20 Product String Registers
      21. 7.6.21 Additional Feature Configuration Register
      22. 7.6.22 Reserved Register
      23. 7.6.23 Reserved Register
      24. 7.6.24 Device Status and Command Register
  9. 8Applications, Implementation, and Layout
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Upstream Port Implementation
        2. 8.2.2.2 Downstream Port 1 Implementation
        3. 8.2.2.3 Downstream Port 2 Implementation
        4. 8.2.2.4 Downstream Port 3 Implementation
        5. 8.2.2.5 Downstream Port 4 Implementation
        6. 8.2.2.6 VBUS Power Switch Implementation
        7. 8.2.2.7 Clock, Reset, I2C/SMBUS, and Misc
        8. 8.2.2.8 Power Implementation
      3. 8.2.3 Application Curve
      4. 8.2.4 Power Supply Recommendations
        1. 8.2.4.1 Power Up and Reset
      5. 8.2.5 Layout
        1. 8.2.5.1 Layout Guidelines
          1. 8.2.5.1.1 Part Placement
          2. 8.2.5.1.2 Board Layout Considerations
            1. 8.2.5.1.2.1  RKM Package – QFN (Quad Flat No-Lead)
            2. 8.2.5.1.2.2  Impedance
            3. 8.2.5.1.2.3  Critical Signals
            4. 8.2.5.1.2.4  Crystal
            5. 8.2.5.1.2.5  USB Interface
            6. 8.2.5.1.2.6  Differential Pair Signals
              1. 8.2.5.1.2.6.1 Internal Bond Wire Mismatch
            7. 8.2.5.1.2.7  Port Connectors
            8. 8.2.5.1.2.8  Reset Terminals
            9. 8.2.5.1.2.9  Miscellaneous Terminals
            10. 8.2.5.1.2.10 Power Control and Battery Charging Terminals
            11. 8.2.5.1.2.11 USB 2.0 Port Indicator LED Terminals
          3. 8.2.5.1.3 Power
            1. 8.2.5.1.3.1 Power
            2. 8.2.5.1.3.2 Downstream Port Power
            3. 8.2.5.1.3.3 Ground
        2. 8.2.5.2 Layout Example
  10. 9Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11.   Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
8.2.5.1.2.6.1 Internal Bond Wire Mismatch

The routing of the SS differential pairs must take into account the internal bond wire mismatch inherent in the dual row RKM package. Internal wire lengths (in mil) are below.

Table 8-2 Internal Bond Wire Mismatch
Signal NamePin No.Bondwire Length (mil)Difference (mil)
USB_SSTXM_UP
USB_SSTXP_UP		A42
B39		125
97		28
USB_SSRXM_UP
USB_SSRXP_UP		B40
A44		89
109		20
USB_DM_UP
USB_DP_UP		B42
A46		81
103		22
USB_DP_DN0
USB_DM_DN0		B1
A1		102
136		34
USB_SSRXP_DN0
USB_SSRXM_DN0		B3
A3		80
112		32
USB_SSTXP_DN0
USB_SSTXM_DN0		B4
A4		72
102		30
USB_SSRXP_DN2
USB_SSRXM_DN2		B6
A7		59
81		22
USB_SSTXP_DN2
USB_SSTXM_DN2		B7
A8		58
81		23
USB_DP_DN2
USB_DM_DN2		A9
B9		82
62		20
USB_DM_DN3
USB_DP_DN3		A31
B29		87
61		26
USB_SSRXP_DN3
USB_SSRXM_DN3		B30
A33		59
81		22
USB_SSTXP_DN3
USB_SSTXM_DN3		B31
A34		58
81		23
USB_SSRXP_DN1
USB_SSRXM_DN1		B33
A36		66
93		27
USB_SSTXP_DN1
USB_SSTXM_DN1		B34
A37		74
101		27
USB_DM_DN1
USB_DP_DN1		A39
B36		126
92		34