SCES991 June   2025 TXG8020 , TXG8021

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 Switching Characteristics, VCCA = 1.8 ± 0.15V
    6. 5.6 Switching Characteristics, VCCA = 2.5 ± 0.2V
    7. 5.7 Switching Characteristics, VCCA = 3.3 ± 0.3V
    8. 5.8 Switching Characteristics, VCCA = 5.0 ± 0.5V
    9. 5.9 Switching Characteristics: Tsk, TMAX
  7. 6 Parameter Measurement Information
    1. 6.1 Load Circuit and Voltage Waveforms
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 7.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 7.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 7.3.3 VCC Disconnect
      4. 7.3.4 Over-Voltage Tolerant Inputs
      5. 7.3.5 Glitch-Free Power Supply Sequencing
      6. 7.3.6 Negative Clamping Diodes
      7. 7.3.7 Fully Configurable Dual-Rail Design
      8. 7.3.8 Supports High-Speed Translation
      9. 7.3.9 AC Noise Rejection
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Regulatory Requirements
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCCA to VGNDA Supply voltage A to Ground voltage A –0.5 6.5 V
VCCB to VGNDB Supply voltage B to Ground voltage B –0.5 6.5 V
VGNDA to VGNDB Voltage between GNDA and GNDB Voltage between GNDA and GNDB -82 82 V
VI Input Voltage(2) I/O Ports (A Port) to VGNDA –0.5 6.5 V
I/O Ports (B Port) to VGNDB –0.5 6.5
VO Voltage applied to any output in the high-impedance or power-off state(2) A Port to VGNDA –0.5 6.5 V
B Port to VGNDB –0.5 6.5
VO Voltage applied to any output in the high or low state(2)(3) A Port to VGNDA –0.5 VCCA + 0.5 V
B Port to VGNDB –0.5 VCCB + 0.5
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 –20 mA
IO Continuous output current –25 25 mA
Continuous current through VCC or GND –100 100 mA
Tj Junction Temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Section 5.1 may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 5.3 Exposure beyond the limits listed in Section 5.3 may affect device reliability.
(2) The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The output positive-voltage rating may be exceeded up to 6.5V maximum if the output current rating is observed.