SCES853E November 2013 – October 2023 TXS0104E-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TXS0104E-Q1 | UNIT | |
---|---|---|---|
PW (TSSOP) | |||
14 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 120.1 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 49.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 61.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 6.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 61.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | °C/W |