JAJSGF8M December   1990  – October 2023 AM26C32 , AM26C32C , AM26C32M

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ±7-V Common-Mode Range With ±200-mV Sensitivity
      2. 7.3.2 Input Fail-Safe Circuitry
      3. 7.3.3 Active-High and Active-Low
      4. 7.3.4 Operates from a Single 5-V Supply
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • W|16
  • J|16
  • FK|20
サーマルパッド・メカニカル・データ
発注情報

5.5 Thermal Information

THERMAL METRIC(1)J (CDIP)FK (LCCC)W (CFP)UNIT
16 PINS20 PINS16 PINS
RθJAJunction-to-ambient thermal resistance

65.6

61.6

99.5°C/W
RθJC(top)Junction-to-case(top) thermal resistance

54.6

36.8

51.5°C/W
RθJBJunction-to-board thermal resistance

42.1

36.1

86.5°C/W
ΨJTJunction-to-top characterization parameter

22.9

31

23.7°C/W
ΨJBJunction-to-bottom characterization parameter

41.6

36

80.2°C/W
RθJC(bottom)Junction-to-case(bottom) thermal resistance

N/A

4.2

N/A

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.