JAJS558H september   1998  – june 2023 LM2676

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 概要 (続き)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics – 3.3-V Version
    6. 7.6  Electrical Characteristics – 5-V Version
    7. 7.7  Electrical Characteristics – 12-V Version
    8. 7.8  Electrical Characteristics – Adjustable Voltage Version
    9. 7.9  Electrical Characteristics – All Output Voltage Versions
    10. 7.10 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Adjustable Output Voltage
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Fixed Output Voltage Typical Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 9.2.1.2.2 Inductor Selection (L1)
          3. 9.2.1.2.3 Output Capacitor Selection (COUT)
          4. 9.2.1.2.4 Catch Diode Selection (D1)
          5. 9.2.1.2.5 Input Capacitor (CIN)
          6. 9.2.1.2.6 Boost Capacitor (CB)
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Adjustable Output Voltage Typical Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Programming Output Voltage
          2. 9.2.2.2.2 Inductor Selection (L1)
          3. 9.2.2.2.3 Output Capacitor Selection (COUT)
          4. 9.2.2.2.4 Catch Diode Selection (D1)
          5. 9.2.2.2.5 Input Capacitor (CIN)
          6. 9.2.2.2.6 Boost Capacitor (CB)
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Typical Application for All Output Voltage Versions
        1. 9.2.3.1 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 WSON Package Devices
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Custom Design with WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 ドキュメントの更新通知を受け取る方法
    4. 10.4 サポート・リソース
    5. 10.5 Trademarks
    6. 10.6 静電気放電に関する注意事項
    7. 10.7 用語集
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Pin Configuration and Functions

GUID-CB8FE117-9960-4159-8E9A-733504C5207B-low.svgFigure 6-1 D or P Package8-Pin SOIC or PDIPTop View
GUID-BF4C1F63-7C3A-4D07-9DF9-BD98CBB1EF34-low.svg
Connect DAP to pin 11 and 12.
Figure 6-2 NHN Package16-Pin WSONTop View
Table 6-1 Pin Functions
PIN I/O DESCRIPTION
NAME SOIC, PDIP WSON
CB 1 1 I Bootstrap capacitor connection for high-side driver. Connect a high-quality, 10-nF capacitor from CB to VSW Pin.
FB 4 8 I Feedback sense input pin. Connect to the midpoint of feedback divider to set VOUT for ADJ version or connect this pin directly to the output capacitor for a fixed output version.
ON/ OFF 5 9 I Enable input to the voltage regulator. High = ON and low = OFF. Pull this pin high or float to enable the regulator
VSW 8 15, 16 O Source pin of the internal high-side FET. This is a switching node. Attached this pin to an inductor and the cathode of the external diode
GND 6 11, 12 — Power ground pins. Connect to system ground. Ground pins of CIN and COUT. Path to CIN must be as short as possible.
VIN 7 14 I Supply input pin to collector pin of high-side FET. Connect to power supply and input bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and GND must be as short as possible.
NC 2, 3 2, 3, 4, 5, 6, 7, 10, 13 — No connect pins