JAJSED9U June 2007 – January 2018 LP3907
PRODUCTION DATA.
PIN | I/O | TYPE(1) | DESCRIPTION | ||
---|---|---|---|---|---|
WQFN NUMBER | DSBGA NUMBER | NAME | |||
1 | B4, B5 | VINLDO12 | I | PWR | Analog power for internal functions (VREF, BIAS, I2C, Logic) |
2 | C4 | EN_T | I | D | Enable for preset power on sequence. (See .) |
3 | C3 | nPOR | O | D | nPOR power on reset pin for both Buck1 and Buck 2. Open drain logic output 100-kΩ pullup resistor. nPOR is pulled to ground when the voltages on these supplies are not good. See Flexible Power-On Reset (Power Good with Delay) section for more info. |
4 | C5 | GND_SW1 | G | G | Buck1 NMOS Power Ground |
5 | D5 | SW1 | O | PWR | Buck1 switcher output pin |
6 | E5 | VIN1 | I | PWR | Power in from either DC source or battery to Buck1 |
7 | D4 | ENSW1 | I | D | Enable pin for Buck1 switcher, a logic HIGH enables Buck1 |
8 | E4 | FB1 | I | A | Buck1 input feedback terminal |
9 | D3 | GND_C | G | G | Non switching core ground pin |
10 | E3 | AVDD | I | PWR | Analog power for Buck converters |
11 | E2 | FB2 | I | A | Buck2 input feedback terminal |
12 | D2 | ENSW2 | I | D | Enable pin for Buck2 switcher, a logic HIGH enables Buck2 |
13 | E1 | VIN2 | I | PWR | Power in from either DC source or Battery to Buck2 |
14 | D1 | SW2 | O | PWR | Buck2 switcher output pin |
15 | C1 | GND_SW2 | G | G | Buck2 NMOS power ground |
16 | C2 | SDA | I/O | D | I2C cata (bidirectional) |
17 | B2 | SCL | I | D | I2C clock |
18 | B1 | GND_L | G | G | LDO ground |
19 | A1 | VINLDO1 | I | PWR | Power in from either DC source or battery to input terminal to LDO1 |
20 | A2 | LDO1 | O | PWR | LDO1 output |
21 | B3 | ENLDO1 | I | D | LDO1 enable pin, a logic HIGH enables the LDO1 |
22 | A3 | ENLDO2 | I | D | LDO2 enable pin, a logic HIGH enables the LDO2 |
23 | A4 | LDO2 | O | PWR | LDO2 output |
24 | A5 | VINLDO2 | I | PWR | Power in from either DC source or battery to input terminal to LDO2. |
DAP | DAP | GND | GND | Connection is not necessary for electrical performance, but it is recommended for better thermal dissipation. |