JAJSLE9 march   2023 OPA928

ADVANCE INFORMATION  

  1. 特長
  2. アプリケーション
  3. 説明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4.     Thermal Information
    5. 6.4 Electrical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Guard Buffer
      2. 7.3.2 Thermal Protection
      3. 7.3.3 Capacitive Load and Stability
      4. 7.3.4 EMI Rejection
      5. 7.3.5 Common-Mode Voltage Range
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Contamination Considerations
      2. 8.1.2 Guarding Considerations
      3. 8.1.3 Humidity Considerations
      4. 8.1.4 Dielectric Relaxation
    2. 8.2 Typical Applications
      1. 8.2.1 High-Impedance (Hi-Z) Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Transimpedance Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 Power-Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  9. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™シミュレーション・ソフトウェア (無償ダウンロード)
        3. 9.1.1.3 TI のリファレンス・デザイン
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Humidity Considerations

The resistance of insulators is substantially affected by both temperature and humidity. Humidity can significantly lower the effective resistance of insulators and cause an increase in leakage current around the affected material. When water molecules settle on the surface of a given material, such as the plastic packaging and PCB, a parallel and more electrically conductive path is created. Effective guarding techniques and appropriate materials can help mitigate this behavior in the sensitive applications.

In some cases, water molecules can also penetrate the surface of a given material. The water molecules in the material increase the conductivity of the body of the material and a reduction of resitance is established across all adjacent nodes. Contrary to surface level leakge paths, leakage through the material cannot me mitigated with guarding techniques. Use PCB materials with low humidity absorption properties to reduce moisture related errors.