JAJSLE9 march   2023 OPA928

ADVANCE INFORMATION  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 説明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4.     Thermal Information
    5. 6.4 Electrical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Guard Buffer
      2. 7.3.2 Thermal Protection
      3. 7.3.3 Capacitive Load and Stability
      4. 7.3.4 EMI Rejection
      5. 7.3.5 Common-Mode Voltage Range
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Contamination Considerations
      2. 8.1.2 Guarding Considerations
      3. 8.1.3 Humidity Considerations
      4. 8.1.4 Dielectric Relaxation
    2. 8.2 Typical Applications
      1. 8.2.1 High-Impedance (Hi-Z) Amplifier
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Transimpedance Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 Power-Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™シミュレーション・ソフトウェア (無償ダウンロード)
        3. 9.1.1.3 TI のリファレンス・デザイン
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

Thermal Information

THERMAL METRIC(1) OPA928 UNIT
D (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 113.9 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 51.4 °C/W
RθJB Junction-to-board thermal resistance 58.0 °C/W
ψJT Junction-to-top characterization parameter 9.0 °C/W
ψJB Junction-to-board characterization parameter 57.1 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.