JAJSPJ0C August   2005  – December 2022 SN74LVCH8T245

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    7. 6.7  Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    8. 6.8  Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    9. 6.9  Switching Characteristics: VCCA = 5 V ± 0.5 V
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design
      2. 8.3.2 Partial-Power-Down Mode Operation
      3. 8.3.3 Active Bus Hold Circuitry
      4. 8.3.4 Balanced High-Drive CMOS Push-Pull Outputs
      5. 8.3.5 VCC Isolation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Enable Times
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 用語集
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) SN74LVCH8T245 UNIT
DB (SSOP) DGV (TVSOP) PW (TSSOP) RHL (VQFN)
24 PINS 24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 88.5 91.1

100.6

 37.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.7 23.7

44.7

 38.1 °C/W
RθJB Junction-to-board thermal resistance 44.1 44.5

55.8

 15.2 °C/W
ψJT Junction-to-top characterization parameter 12.8 0.6

6.8

 0.7 °C/W
ψJB Junction-to-board characterization parameter 43.6 44.1

55.4

 15.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — — 4.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.