JAJSKW6
december 2020
TMUXHS4412
PRODUCTION DATA
1
1
特長
2
アプリケーション
3
概要
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
High-Speed Performance Parameters
6.7
Switching Characteristics
6.8
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Output Enable and Power Savings
7.3.2
Data Line Biasing
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
PCIe Lane Muxing
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Pin-to-pin Passive versus Redriver Option
8.2.1.4
Application Curves
8.3
Systems Examples
8.3.1
PCIe Muxing for Hybrid SSD
8.3.2
DisplayPort Main Link
8.3.3
USB 4.0 / TBT 3.0 Demuxing
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
ドキュメントの更新通知を受け取る方法
11.2
サポート・リソース
11.3
Trademarks
11.4
静電気放電に関する注意事項
11.5
用語集
12
Mechanical, Packaging, and Orderable Information
パッケージ・オプション
メカニカル・データ(パッケージ|ピン)
RUA|42
MPQF210D
サーマルパッド・メカニカル・データ
RUA|42
QFND142D
発注情報
jajskw6_oa
jajskw6_pm
6.2
ESD Ratings
VALUE
UNIT
V
ESD
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±250
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.