JAJSGC8B October   2018  – January 2020 TPS25982

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     概略回路図
  4. 4 改訂履歴
  5. 5 デバイス比較表
  6. 6 概要 (続き)
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Undervoltage Protection (UVLO and UVP)
      2. 9.3.2 Overvoltage Protection (OVP)
      3. 9.3.3 Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 9.3.3.1 Slew Rate and Inrush Current Control (dVdt)
        2. 9.3.3.2 Circuit Breaker
        3. 9.3.3.3 Active Current Limiting
        4. 9.3.3.4 Short-Circuit Protection
      4. 9.3.4 Overtemperature Protection (OTP)
      5. 9.3.5 Analog Load Current Monitor (IMON)
      6. 9.3.6 Power Good (PG)
      7. 9.3.7 Load Detect/Handshake (LDSTRT)
    4. 9.4 Fault Response
    5. 9.5 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application: Standby Power Rail Protection in Datacenter Servers
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Device Selection
        2. 10.2.2.2 Setting the Current Limit Threshold: RILIM Selection
        3. 10.2.2.3 Setting the Undervoltage Lockout Set Point
        4. 10.2.2.4 Choosing the Current Monitoring Resistor: RIMON
        5. 10.2.2.5 Setting the Output Voltage Ramp Time (TdVdt)
          1. 10.2.2.5.1 Case 1: Start-Up Without Load: Only Output Capacitance COUT Draws Current
          2. 10.2.2.5.2 Case 2: Start-Up With Load: Output Capacitance COUT and Load Draw Current
        6. 10.2.2.6 Setting the Load Handshake (LDSTRT) Delay
        7. 10.2.2.7 Setting the Transient Overcurrent Blanking Interval (tITIMER)
        8. 10.2.2.8 Setting the Auto-Retry Delay and Number of Retries
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Optical Module Power Rail Path Protection
        1. 10.3.1.1 Design Requirements
        2. 10.3.1.2 Device Selection
        3. 10.3.1.3 External Component Settings
        4. 10.3.1.4 Voltage Drop
        5. 10.3.1.5 Application Curves
      2. 10.3.2 Input Protection for 12-V Rail Applications: PCIe Cards, Storage Interfaces and DC Fans
  11. 11Power Supply Recommendations
    1. 11.1 Transient Protection
    2. 11.2 Output Short-Circuit Measurements
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 ドキュメントのサポート
      1. 13.1.1 関連資料
        1. 13.1.1.1 関連リンク
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 コミュニティ・リソース
    4. 13.4 商標
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.2.2.5 Setting the Output Voltage Ramp Time (TdVdt)

For a successful design, the junction temperature of device must be kept below the absolute maximum rating during both dynamic (start-up) and steady state conditions. Dynamic power stresses often are an order of magnitude greater than the static stresses, so it is important to determine the right start-up time and in-rush current limit required with system capacitance to avoid thermal shutdown during start-up with and without load.

The required ramp-up capacitor CdVdt is calculated considering the two possible cases (see Case 1: Start-Up Without Load: Only Output Capacitance COUT Draws Current and Case 2: Start-Up With Load: Output Capacitance COUT and Load Draw Current)