JAJSGZ1C September   2015  – February  2019 TPS65094

PRODUCTION DATA.  

  1. 1 デバイスの概要
    1. 1.1 特長
    2. 1.2 アプリケーション
    3. 1.3 概要
    4. 1.4 機能ブロック図
  2. 2 改訂履歴
  3. 3 Device Options
    1. 3.1 OTP Comparison
  4. 4 Pin Configuration and Functions
    1.     RSK Package 64-Pin VQFN With Thermal Pad Top View
    2.     Pin Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: Total Current Consumption
    6. 5.6  Electrical Characteristics: Reference and Monitoring System
    7. 5.7  Electrical Characteristics: Buck Controllers
    8. 5.8  Electrical Characteristics: Synchronous Buck Converters
    9. 5.9  Electrical Characteristics: LDOs
    10. 5.10 Electrical Characteristics: Load Switches
    11. 5.11 Digital Signals: I2C Interface
    12. 5.12 Digital Input Signals (LDOLS_EN, SWA1_EN, THERMTRIPB, PMICEN, SLP_S3B, SLP_S4B, SLP_S0B)
    13. 5.13 Digital Output Signals (IRQB, RSMRSTB, PCH_PWROK, PROCHOT)
    14. 5.14 Timing Requirements
    15. 5.15 Switching Characteristics
    16. 5.16 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Power Good (PGOOD)
      2. 6.3.2 Register Reset Conditions
      3. 6.3.3 SMPS Voltage Regulators
        1. 6.3.3.1 Controller Overview
        2. 6.3.3.2 Converter Overview
        3. 6.3.3.3 DVS
        4. 6.3.3.4 Current Limit
      4. 6.3.4 LDOs and Load Switches
        1. 6.3.4.1 VTT LDO
        2. 6.3.4.2 LDOA1–LDOA3
        3. 6.3.4.3 Load Switches
      5. 6.3.5 Power Sequencing and VR Control
        1. 6.3.5.1 Cold Boot
        2. 6.3.5.2 Cold OFF
        3. 6.3.5.3 Connected Standby Entry and Exit
        4. 6.3.5.4 S0 to S3 Entry and Exit
        5. 6.3.5.5 S0 to S4/5 Entry and Exit
        6. 6.3.5.6 Emergency Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Off Mode
      2. 6.4.2 Standby Mode
      3. 6.4.3 Active Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
        1. 6.5.1.1 F/S-Mode Protocol
    6. 6.6 Register Maps
      1. 6.6.1  VENDORID: PMIC Vendor ID Register (offset = 00h) [reset = 0010 0010]
        1. Table 6-12 VENDORID Register Field Descriptions
      2. 6.6.2  DEVICEID: PMIC Device and Revision ID Register (offset = 01h) [reset = OTP Dependent]
        1. Table 6-13 DEVICEID Register Field Descriptions
      3. 6.6.3  IRQ: PMIC Interrupt Register (offset = 02h) [reset = 0000 0000]
        1. Table 6-14 IRQ Register Field Descriptions
      4. 6.6.4  IRQ_MASK: PMIC Interrupt Mask Register (offset = 03h) [reset = 1111 1111]
        1. Table 6-15 IRQ_MASK Register Field Descriptions
      5. 6.6.5  PMICSTAT: PMIC Status Register (offset = 04h) [reset = 0000 0000]
        1. Table 6-16 PMICSTAT Register Field Descriptions
      6. 6.6.6  OFFONSRC: PMIC Power Transition Event Register (offset = 05h) [reset = 0000 0000]
        1. Table 6-17 OFFONSRC Register Field Descriptions
      7. 6.6.7  BUCK1CTRL: BUCK1 Control Register (offset = 20h) [reset = 0011 1000]
        1. Table 6-18 BUCK1CTRL Register Field Descriptions
      8. 6.6.8  BUCK2CTRL: BUCK2 Control Register (offset = 21h) [reset = 0000 0000]
        1. Table 6-19 BUCK2CTRL Register Field Descriptions
      9. 6.6.9  BUCK3CTRL: BUCK3 Control Register (offset = 23h) [reset = 0001 0001]
        1. Table 6-20 BUCK3CTRL Register Field Descriptions
      10. 6.6.10 BUCK4CTRL: BUCK4 Control Register (offset = 25h) [reset = 0011 1101]
        1. Table 6-21 BUCK4CTRL Register Field Descriptions
      11. 6.6.11 BUCK5CTRL: BUCK5 Control Register (offset = 26h) [reset = 0011 1101]
        1. Table 6-22 BUCK5CTRL Register Field Descriptions
      12. 6.6.12 BUCK6CTRL: BUCK6 Control Register (offset = 27h) [reset = 0011 1101]
        1. Table 6-23 BUCK6CTRL Register Field Descriptions
      13. 6.6.13 DISCHCNT1: Discharge Control1 Register (offset = 40h) [reset = 0101 0101]
        1. Table 6-24 DISCHCNT1 Register Field Descriptions
      14. 6.6.14 DISCHCNT2: Discharge Control2 Register (offset = 41h) [reset = 0101 0101]
        1. Table 6-25 DISCHCNT2 Register Field Descriptions
      15. 6.6.15 DISCHCNT3: Discharge Control3 Register (offset = 42h) [reset = 0000 0101]
        1. Table 6-26 DISCHCNT3 Register Field Descriptions
      16. 6.6.16 POK_DELAY: PCH_PWROK Delay Register (offset = 43h) [reset = 0000 0111]
        1. Table 6-27 POK_DELAY Register Field Descriptions
      17. 6.6.17 FORCESHUTDN: Force Emergency Shutdown Control Register (offset = 91h) [reset = 0000 0000]
        1. Table 6-28 FORCESHUTDN Register Field Descriptions
      18. 6.6.18 BUCK4VID: BUCK4 VID Register (offset = 94h) [reset = 0010 1111]
        1. Table 6-29 BUCK4VID Register Field Descriptions
      19. 6.6.19 BUCK5VID: BUCK5 VID Register (offset = 96h) [reset = 0100 1011]
        1. Table 6-30 BUCK5VID Register Field Descriptions
      20. 6.6.20 BUCK6VID: BUCK6 VID Register (offset = 98h) [reset = OTP Dependent]
        1. Table 6-31 BUCK6VID Register Field Descriptions
      21. 6.6.21 LDOA2VID: LDOA2 VID Register (offset = 9Ah) [reset = OTP Dependent]
        1. Table 6-32 LDOA2VID Register Field Descriptions
      22. 6.6.22 LDOA3VID: LDOA3 VID Register (offset = 9Bh) [reset = OTP Dependent]
        1. Table 6-33 LDOA3VID Register Field Descriptions
      23. 6.6.23 VR_CTRL1: BUCK1-3 Control Register (offset = 9Ch) [reset = 0000 0111]
        1. Table 6-34 VR_CTRL1 Register Field Descriptions
      24. 6.6.24 VR_CTRL2: VR Enable Register (offset = 9Eh) [reset = 0000 0000]
        1. Table 6-35 VR_CTRL2 Register Field Descriptions
      25. 6.6.25 VR_CTRL3: VR Enable/Disable Register (offset = 9Fh) [reset = 0111 0000]
        1. Table 6-36 VR_CTRL3 Register Field Descriptions
      26. 6.6.26 GPO_CTRL: GPO Control Register (offset = A1h) [reset = 0010 0000]
        1. Table 6-37 GPO_CTRL Register Field Descriptions
      27. 6.6.27 PWR_FAULT_MASK1: VR Power Fault Mask1 Register (offset = A2h) [reset = 1100 0000]
        1. Table 6-38 PWR_FAULT_MASK1 Register Field Descriptions
      28. 6.6.28 PWR_FAULT_MASK2: VR Power Fault Mask2 Register (offset = A3h) [reset = 0011 0111]
        1. Table 6-39 PWR_FAULT_MASK2 Register Field Descriptions
      29. 6.6.29 DISCHCNT4: Discharge Control4 Register (offset = ADh) [reset = 0110 0001]
        1. Table 6-40 DISCHNT4 Register Field Descriptions
      30. 6.6.30 LDOA1CTRL: LDOA1 Control Register (offset = AEh) [reset = OTP Dependent]
        1. Table 6-41 LDOA1CTRL Register Field Descriptions
      31. 6.6.31 PG_STATUS1: Power Good Status1 Register (offset = B0h) [reset = 0000 0000]
        1. Table 6-42 PG_STATUS1 Register Field Descriptions
      32. 6.6.32 PG_STATUS2: Power Good Status2 Register (offset = B1h) [reset = 0000 0000]
        1. Table 6-43 PG_STATUS2 Register Field Descriptions
        2. 6.6.32.1   PWR_FAULT_STATUS1: Power Fault Status1 Register (offset = B2h) [reset = 0000 0000]
          1. Table 6-44 PWR_FAULT_STATUS1 Register Field Descriptions
        3. 6.6.32.2   PWR_FAULT_STATUS2: Power Fault Status2 Register (offset = B3h) [reset = 0000 0000]
          1. Table 6-45 PWR_FAULT_STATUS2 Register Field Descriptions
      33. 6.6.33 TEMPHOT: Temperature Hot Status Register (offset = B5h) [reset = 0000 0000]
        1. Table 6-46 TEMPHOT Register Field Descriptions
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Controller Design Procedure
          1. 7.2.2.1.1 Selecting the Output Capacitors
          2. 7.2.2.1.2 Selecting the Inductor
          3. 7.2.2.1.3 Selecting the FETs
          4. 7.2.2.1.4 Bootstrap Capacitor
          5. 7.2.2.1.5 Selecting the Input Capacitors
            1. 7.2.2.1.5.1 Setting the Current Limit
        2. 7.2.2.2 Converter Design Procedure
          1. 7.2.2.2.1 Selecting the Inductor
          2. 7.2.2.2.2 Selecting the Output Capacitors
          3. 7.2.2.2.3 Selecting the Input Capacitors
        3. 7.2.2.3 LDO Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Specific Application for TPS650944
    4. 7.4 Do's and Don'ts
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  10. 10デバイスおよびドキュメントのサポート
    1. 10.1 デバイス・サポート
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 開発サポート
    2. 10.2 ドキュメントのサポート
      1. 10.2.1 関連資料
    3. 10.3 ドキュメントの更新通知を受け取る方法
    4. 10.4 Community Resources
    5. 10.5 商標
    6. 10.6 静電気放電に関する注意事項
    7. 10.7 Glossary
  11. 11メカニカル、パッケージ、および注文情報
    1. 11.1 Package Option Addendum
      1. 11.1.1 Packaging Information
      2. 11.1.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11.1.1 Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish(4) MSL Peak Temp (3) Op Temp (°C) Device Marking(5)(6)
TPS650945RSKR ACTIVE VQFN RSK 64 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 T650945
PG1.0
TPS650945RSKT ACTIVE VQFN RSK 64 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR -40 to 85 T650945
PG1.0
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
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(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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(4) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
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(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
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(6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
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