JAJSOP6A may   2022  – march 2023 TPS65219

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  System Control Thresholds
    6. 6.6  BUCK1 Converter
    7. 6.7  BUCK2, BUCK3 Converter
    8. 6.8  General Purpose LDOs (LDO1, LDO2)
    9. 6.9  General Purpose LDOs (LDO3, LDO4)
    10. 6.10 GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO1, GPO2, GPIO, MODE/RESET, MODE/STBY, VSEL_SD/VSEL_DDR)
    11. 6.11 Voltage and Temperature Monitors
    12. 6.12 I2C Interface
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power-Up Sequencing
      2. 7.3.2  Power-Down Sequencing
      3. 7.3.3  Push Button and Enable Input (EN/PB/VSENSE)
      4. 7.3.4  Reset to SoC (nRSTOUT)
      5. 7.3.5  Buck Converters (Buck1, Buck2, and Buck3)
      6. 7.3.6  Linear Regulators (LDO1 through LDO4)
      7. 7.3.7  Interrupt Pin (nINT)
      8. 7.3.8  PWM/PFM and Low Power Modes (MODE/STBY)
      9. 7.3.9  PWM/PFM and Reset (MODE/RESET)
      10. 7.3.10 Voltage Select pin (VSEL_SD/VSEL_DDR)
      11. 7.3.11 General Purpose Inputs or Outputs (GPO1, GPO2, and GPIO)
      12. 7.3.12 I2C-Compatible Interface
        1. 7.3.12.1 Data Validity
        2. 7.3.12.2 Start and Stop Conditions
        3. 7.3.12.3 Transferring Data
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
        1. 7.4.1.1 OFF State
        2. 7.4.1.2 INITIALIZE State
        3. 7.4.1.3 ACTIVE State
        4. 7.4.1.4 STBY State
        5. 7.4.1.5 Fault Handling
    5. 7.5 User Registers
    6. 7.6 Device Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application Example
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Buck1, Buck2, Buck3 Design Procedure
        2. 8.2.3.2 LDO1, LDO2 Design Procedure
        3. 8.2.3.3 LDO3, LDO4 Design Procedure
        4. 8.2.3.4 VSYS, VDD1P8
        5. 8.2.3.5 Digital Signals Design Procedure
    3. 8.3 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  10. 10Mechanical, Packaging, and Orderable Information

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • RSM|32
  • RHB|32
サーマルパッド・メカニカル・データ

7.3.10 Voltage Select pin (VSEL_SD/VSEL_DDR)

The function of this pin is configured by VSEL_DDR_SD in MFP_1_CONFIG.

When configured as VSEL_SD, the bit VSEL_RAIL in MFP_1_CONFIG register selects LDO1 or LDO2 to be controlled by the pin. The configuration must not change after power-up.

VSEL_SD/VSEL_DDR configured as 'VSEL_SD': SD-card-IO-select:

The polarity of this pin can be configured by writing to VSEL_SD_POLARITY in MFP_1_CONFIG register. Toggling the pin changes the output voltage of the selected LDO between hard-coded 1.8 V and the voltage configured in LDOx_VOUT. For the SD-card-IO-supply, LDOx_VOUT must be configured for 3.3 V. A change of the VSEL_SD status does not cause a state-transition.

CAUTION: In SD-card-configuration, customer must configure the pin-polarity and drive the pin so that the LDO delivers 3.3 V at start-up.

VSEL_SD/VSEL_DDR configured as 'VSEL_DDR':

Pulling this pin high sets the output voltage of Buck3 to 1.35 V (DDR3LV), leaving the pin floating sets the output voltage of Buck3 to 1.2 V (DDR4, LP-DDR3, some LP-DDR2), pulling the pin low sets the output voltage of the Buck3 voltage configured in BUCK3_VOUT. For LP-DDR4, BUCK3_VOUT must be configured to 1.1 V.

CAUTION: This function needs to be hard-wired and must not change during operation.
CAUTION: The VSEL_RAIL still needs to be configured for the LDO that supplies the SD-card-IO-voltage, as an I2C-command toggles the selected LDO-rail for the SD-card. The VSEL_SD_POLARITY bit has no effect if the pin is configured as VSEL_DDR.

The Table below shows the various combinations.

Table 7-4 VSEL_SD/VSEL_DDR configuration options
VSEL_DDR_SDVSEL_SD_POLARITYVSEL_RAILPIN status VSEL_SD/VSEL_DDROutput (V)Rail
0:DDRn/a0 =LDO1; 1=LDO2 (needed for I2C control)0BUCK3_VOUT BUCK3
0:DDRn/a0 =LDO1; 1=LDO2 (needed for I2C control)open1.2 VBUCK3
0:DDRn/a0 =LDO1; 1=LDO2 (needed for I2C control)11.35 VBUCK3
1:SD00 =LDO101.8 VLDO1
1:SD00 =LDO11LDO1_VOUTLDO1
1:SD10 =LDO10LDO1_VOUT LDO1
1:SD10 =LDO111.8 VLDO1
1:SD01 =LDO201.8 VLDO2
1:SD01 =LDO21LDO2_VOUTLDO2
1:SD11 =LDO20LDO2_VOUTLDO2
1:SD11 =LDO211.8 VLDO2