JAJSEM6K April   2006  – March 2025 TXB0104

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics (BQA/DYY)
    6. 5.6  Electrical Characteristics (Other Packages)
    7. 5.7  Timing Requirements: VCCA = 1.2 V
    8. 5.8  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    9. 5.9  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    10. 5.10 Timing Requirements: VCCA = 2.5 V ± 0.2 V
    11. 5.11 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    12. 5.12 Switching Characteristics: VCCA = 1.2 V (BQA/DYY)
    13. 5.13 Switching Characteristics: VCCA = 1.2 V (Other Packages)
    14. 5.14 Switching Characteristics: VCCA = 1.5 V ± 0.1 V (BQA/DYY)
    15. 5.15 Switching Characteristics: VCCA = 1.5 V ± 0.1 V (Other Packages)
    16. 5.16 Switching Characteristics: VCCA = 1.8 V ± 0.15 V (BQA/DYY)
    17. 5.17 Switching Characteristics: VCCA = 1.8 V ± 0.15 V (Other Packages)
    18. 5.18 Switching Characteristics: VCCA = 2.5 V ± 0.2 V (BQA/DYY)
    19. 5.19 Switching Characteristics: VCCA = 2.5 V ± 0.2 V (Other Packages)
    20. 5.20 Switching Characteristics: VCCA = 3.3 V ± 0.3 V (BQA/DYY)
    21. 5.21 Switching Characteristics: VCCA = 3.3 V ± 0.3 V (Other Packages)
    22. 5.22 Operating Characteristics: VCCA = 1.2 V to 1.5 V, VCCB = 1.5 V to 1.8 V
    23. 5.23 Operating Characteristics: VCCA = 1.8 V to 3.3 V, VCCB = 1.8 V to 5 V
    24. 5.24 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 用語集
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

TXB0104 GXU and ZXU Package,12-Pin BGA Microstar Junior(Top View)Figure 4-1 GXU and ZXU Package,12-Pin BGA Microstar Junior(Top View)
TXB0104 YZT Package,12-Pin DSBGA(Top View)Figure 4-3 YZT Package,12-Pin DSBGA(Top View)
TXB0104 BQA Package,14-Pin WQFN With Exposed Thermal Pad(Top View)Figure 4-5 BQA Package,14-Pin WQFN With Exposed Thermal Pad(Top View)
TXB0104 RUT Package,12-Pin UQFN(Top View)Figure 4-7 RUT Package,12-Pin UQFN(Top View)
TXB0104 NMN Package,12-Pin NFBGA(Top View)Figure 4-2 NMN Package,12-Pin NFBGA(Top View)
TXB0104 D/PW/DYY Package,14-Pin SOIC/TSSOP/SOT(Top View)
NC − No internal connection
Figure 4-4 D/PW/DYY Package,14-Pin SOIC/TSSOP/SOT(Top View)
TXB0104 RGY Package,14-Pin VQFN With Exposed Thermal Pad(Top View)
NC − No internal connection
Figure 4-6 RGY Package,14-Pin VQFN With Exposed Thermal Pad(Top View)
Table 4-1 Pin Functions
PIN I/O DESCRIPTION
NAME D, PW BQA, RGY RUT GXU, ZXU, NMN YZT
A1 2 2 2 A1 A3 I/O Input/output 1. Referenced to VCCA.
A2 3 3 3 A2 B3 I/O Input/output 2. Referenced to VCCA.
A3 4 4 4 A3 C3 I/O Input/output 3. Referenced to VCCA.
A4 5 5 5 A4 D3 I/O Input/output 4. Referenced to VCCA.
B1 13 13 10 C1 A1 I/O Input/output 1. Referenced to VCCB.
B2 12 12 9 C2 B1 I/O Input/output 2. Referenced to VCCB.
B3 11 11 8 C3 C1 I/O Input/output 3. Referenced to VCCB.
B4 10 10 7 C4 D1 I/O Input/output 4. Referenced to VCCB.
GND 7 7 6 B4 D2 — Ground
NC 6, 9 6,9 — — — — No connection. Not internally connected.
OE 8 8 12 B3 C2 I Tri-state output-mode enable. Pull OE low to place all outputs in tri-state mode. Referenced to VCCA.
VCCA 1 1 1 B2 B2 — A-port supply voltage 1.2V ≤ VCCA ≤ 3.6V and VCCA ≤ VCCB.
VCCB 14 14 11 B1 A2 — B-port supply voltage 1.65V ≤ VCCB ≤ 5.5V.
Thermal pad — — — — — For the BQA, RGY package, the exposed center thermal pad must either be connected to Ground or left electrically open.
Table 4-2 Pin Assignments: NMN, GXU and ZXU Package
ABC
4A4GNDB4
3A3OEB3
2A2VCCAB2
1A1VCCBB1
Table 4-3 Pin Assignments: YZT Package
321
DA4GNDB4
CA3OEB3
BA2VCCAB2
AA1VCCBB1