SPRAD85 March 2023 AM62A3 , AM62A3-Q1 , AM62A7 , AM62A7-Q1
The Thermal Design Guide for DSP and Arm Application Processors application report provides guidance for successful implementation of a thermal solution for board designs containing this device. This document provides information on common terms and methods related to thermal solutions. TI only supports designs that follow board design guidelines contained in the application report.
For more information, see AM62Ax Thermal Model.