SPRADC1 june   2023 DRA829J , DRA829V , TDA4VM

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Different Types of Memories on the TDA4VM
  5. 2Memory Overview and Intended Usage
    1. 2.1 PSROM
      1. 2.1.1 Typical Use Cases
    2. 2.2 PSRAM
      1. 2.2.1 Typical Use Cases
    3. 2.3 MSMC RAM
      1. 2.3.1 Typical Use Cases
      2. 2.3.2 Relevant Links
    4. 2.4 MSRAM
      1. 2.4.1 Typical Use Cases
    5. 2.5 ARM Cortex A72 Subsystem
      1. 2.5.1 L1/L2 Cache Memory
      2. 2.5.2 L3 Memory
      3. 2.5.3 Relevant Links
    6. 2.6 ARM Cortex R5F Subsystem
      1. 2.6.1 L1 Memory System
      2. 2.6.2 Cache
      3. 2.6.3 Tightly Coupled Memory (TCM)
      4. 2.6.4 Typical Use Case
      5. 2.6.5 Relevant Links
    7. 2.7 TI's C6x Subsystem
      1. 2.7.1 Memory Layout
      2. 2.7.2 Relevant Links
    8. 2.8 TI's C7x Subsystem
      1. 2.8.1 Memory Layout
      2. 2.8.2 Relevant Links
    9. 2.9 DDR Subsystem
      1. 2.9.1 Relevant Links
  6. 3Performance numbers
    1. 3.1 SDK Data Sheet
    2. 3.2 Memory Access Latency
  7. 4Software Careabouts When Using Different Memories
    1. 4.1 How to Modify Memory Map for RTOS Firmwares
    2. 4.2 DDR Sharing Between RTOS Core and HLOS
    3. 4.3 MCU On-Chip RAM Usage by Bootloader
    4. 4.4 MSMC RAM Default SDK Usage
      1. 4.4.1 MSMC RAM Reserved Sections
      2. 4.4.2 MSMC RAM Configuration as Cache and SRAM
    5. 4.5 Usage of ATCM from MCU R5F
    6. 4.6 Usage of DDR to Execute Code from R5F
  8. 5Summary

4.4.2 MSMC RAM Configuration as Cache and SRAM

The configuration of the MSMC RAM as Cache or SRAM is dictated by the common board configuration passed to the Device Manager. For details on how to do this, see the SDK documentation’s developer note on How to configure K3 MSMC memory for use as SRAM or L3 cache?.

Default SDK configures the whole of MSMC as SRAM and gives this to the C7x DSP for running deep learning algorithms. This configuration can be changed based on the customer use cases.