DLPS284 December   2025 DLP3940S-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5.     11
    6. 5.5  Thermal Information
    7. 5.6  Electrical Characteristics
    8. 5.7  Switching Characteristics
    9. 5.8  Timing Requirements
    10.     16
    11. 5.9  System Mounting Interface Loads
    12.     18
    13. 5.10 Micromirror Array Physical Characteristics
    14.     20
    15. 5.11 Micromirror Array Optical Characteristics
    16. 5.12 Window Characteristics
    17. 5.13 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 SubLVDS Data Interface
      2. 6.3.2 Low Speed Interface for Control
      3. 6.3.3 Power Interface
      4. 6.3.4 Timing
    4. 6.4 Device Functional Modes
    5. 6.5 Optical Interface and System Image Quality Considerations
      1. 6.5.1 Numerical Aperture and Stray Light Control
      2. 6.5.2 Pupil Match
      3. 6.5.3 Illumination Overfill
    6. 6.6 Micromirror Array Temperature Calculation
      1. 6.6.1 Monitoring Array Temperature Using the Temperature Sense Diode
    7. 6.7 Micromirror Power Density Calculation
    8. 6.8 Window Aperture Illumination Overfill Calculation
    9. 6.9 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 6.9.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Application Overview
      2. 7.2.2 Input Image Resolution
      3. 7.2.3 Reference Design
      4. 7.2.4 Application Mission Profile Consideration
      5. 7.2.5 Design Requirements
      6. 7.2.6 Detailed Design Procedure
    3. 7.3 Temperature Sensing
      1. 7.3.1 Temperature Sensing Diode
        1. 7.3.1.1 Temperature Sense Diode Theory
  9. 8 Power Supply Recommendations
    1. 8.1 DMD Power Supply Power-Up Procedure
    2. 8.2 DMD Power Supply Power-Down Procedure
    3. 8.3 DMD Power Supply Sequencing Requirements
  10. 9 Layout
    1. 9.1 Layout Guidelines
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Device Support
      1. 10.2.1 Device Nomenclature
      2. 10.2.2 Device Markings
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5.11 Micromirror Array Optical Characteristics

PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
Micromirror tilt angle DMD landed state (1)(2)(3)(4) 13.5 14.5 15.5 degrees
Micromirror crossover time(5) 1 3 µs
Micromirror switching time(6) 6 µs
Image Performance(7) Bright pixel(s) in active area(8) Gray 10 Screen(9) 0 Micromirrors
Bright pixel(s) in the POM(10) Gray 10 Screen(9) 1
Dark pixel(s) in the active area(11) White Screen 4
Adjacent pixel(s)(12) Any Screen 0
Unstable pixel(s) in active area(13) Any Screen 0
(1) Measured relative to the plane formed by the overall micromirror array.
(2) Additional variation exists between the micromirror array and the package datums.
(3) Represents the variation that can occur between any two individual micromirrors, located on the same device or on different devices.
(4) For some applications, it is critical to account for the micromirror tilt angle variation in the overall system optical design. With some system optical designs, the micromirror tilt angle variation within a device may result in perceivable non-uniformities in the light field reflected from the micromirror array. With some system optical designs, the micromirror tilt angle variation between devices may result in colorimetry variations, system efficiency variations, or system contrast variations.
(5) The time required for a micromirror to nominally transition from one landed state to the opposite landed state.
(6) The minimum time between successive transitions of a micromirror.
(7) Conditions of Acceptance: All DMD image quality returns will be evaluated using the following projected image test conditions:
• Test set degamma shall be linear.
• Test set brightness and contrast shall be set to nominal.
• The diagonal size of the projected image shall be a minimum of 20 inches.
• The projections screen shall be unity gain.
• The projected image shall be inspected from a 38-inch minimum viewing distance.
• The image shall be in focus during all image quality tests.
(8) Bright pixel definition: A single pixel or mirror that is stuck in the ON position and is visibly brighter than the surrounding pixels.
(9) Gray 10 screen definition: All areas of the screen are colored with the following settings:
Red = 10/255
Green = 10/255
Blue = 10/255
(10) POM definition: Rectangular border of off-state mirrors surrounding the active area.
(11) Dark pixel definition: A single pixel or mirror that is stuck in the OFF position and is visibly darker than the surrounding pixels.
(12) Adjacent pixel definition: Two or more stuck pixels sharing a common border or common point, also referred to as a cluster.
(13) Unstable pixel definition: A single pixel or mirror that does not operate in sequence with parameters loaded into memory. The unstable pixel appears to be flickering asynchronously with the image.