SBAS729C June   2016  – August 2026 ADS8920B , ADS8922B , ADS8924B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 LDO Module
      2. 6.3.2 Reference Buffer Module
      3. 6.3.3 Converter Module
        1. 6.3.3.1 Sample-and-Hold Circuit
        2. 6.3.3.2 Internal Oscillator
        3. 6.3.3.3 ADC Transfer Function
      4. 6.3.4 Interface Module
    4. 6.4 Device Functional Modes
      1. 6.4.1 RST State
      2. 6.4.2 ACQ State
      3. 6.4.3 CNV State
    5. 6.5 Programming
      1. 6.5.1 Output Data Word
      2. 6.5.2 Data Transfer Frame
      3. 6.5.3 Interleaving Conversion Cycles and Data Transfer Frames
      4. 6.5.4 Data Transfer Protocols
        1. 6.5.4.1 Protocols for Configuring the Device
        2. 6.5.4.2 Protocols for Reading From the Device
          1. 6.5.4.2.1 Legacy, SPI-Compatible (SYS-xy-S) Protocols
          2. 6.5.4.2.2 SPI-Compatible Protocols with Bus Width Options
          3. 6.5.4.2.3 Source-Synchronous (SRC) Protocols
            1. 6.5.4.2.3.1 Output Clock Source Options with SRC Protocols
            2. 6.5.4.2.3.2 Bus Width Options With SRC Protocols
            3. 6.5.4.2.3.3 Output Data Rate Options With SRC Protocols
      5. 6.5.5 Device Setup
        1. 6.5.5.1 Single Device: All multiSPI Options
        2. 6.5.5.2 Single Device: Minimum Pins for a Standard SPI
        3. 6.5.5.3 Multiple Devices: Daisy-Chain Topology
        4. 6.5.5.4 Multiple Devices: Star Topology
  8. 7 Register Maps
    1. 7.1 Device Configuration and Register Maps
      1. 7.1.1 PD_CNTL Register (address = 04h) [reset = 08h]
      2. 7.1.2 SDI_CNTL Register (address = 008h) [reset = 00h]
      3. 7.1.3 SDO_CNTL Register (address = 0Ch) [reset = 00h]
      4. 7.1.4 DATA_CNTL Register (address = 010h) [reset = 00h]
      5. 7.1.5 PATN_LSB Register (address = 014h) [reset = 00h]
      6. 7.1.6 PATN_MID Register (address = 015h) [reset = 00h]
      7. 7.1.7 PATN_MSB Register (address = 016h) [reset = 00h]
      8. 7.1.8 OFST_CAL Register (address = 020h) [reset = 00h]
      9. 7.1.9 REF_MRG Register (address = 030h) [reset = 00h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 ADC Reference Driver
      2. 8.1.2 ADC Input Driver
        1. 8.1.2.1 Charge-Kickback Filter
        2. 8.1.2.2 Input Amplifier Selection
    2. 8.2 Typical Application
      1. 8.2.1 Data Acquisition (DAQ) Circuit for Lowest Distortion and Noise Performance With Differential Input
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DAQ Circuit With FDA Input Driver and Single-Ended or Differential Input
      3. 8.2.3 Design Requirements
      4. 8.2.4 Detailed Design Procedure
      5. 8.2.5 Application Curves
    3. 8.3 Power-Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Signal Path
        2. 8.4.1.2 Grounding and PCB Stack-Up
        3. 8.4.1.3 Decoupling of Power Supplies
        4. 8.4.1.4 Reference Decoupling
        5. 8.4.1.5 Differential Input Decoupling
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Detailed Design Procedure

The application circuit is illustrated in Figure 8-2. For simplicity, power-supply decoupling capacitors are not shown in these circuit diagrams; see the Power-Supply Recommendations section for suggested guidelines.

The reference voltage of 4.5V is generated by the high-precision, low-noise REF5045 circuit. The output broadband noise of the reference is heavily filtered by a low-pass filter with a 3dB cutoff frequency of 16Hz.

Generally, the distortion from the input driver must be at least 10dB less than the ADC distortion. The low-power OPA2625 (a high-bandwidth, low-distortion, high-precision amplifier in an inverting gain configuration) as an input driver provides exceptional ac performance because of extremely low-distortion and high-bandwidth specifications. The distortion resulting from variation in the common-mode signal is eliminated by using the OPA2625 in an inverting gain configuration. To exercise the complete dynamic range of the device, the common-mode voltage at the ADS892xB inputs is established at a value of 2.25V (4.5V / 2) by using the noninverting pins of the OPA2625 amplifiers. In addition, the components of the charge kickback filter keep the noise from the front-end circuit low without adding distortion to the input signal.

For a complete schematic, see the ADS8920BEVM-PDK user's guide located in the ADS8920B SAR Analog to Digital Converter Evaluation Module web folder at www.ti.com.

A similar circuit is used in reference design TIPD211, a step-by-step process to design a 20-Bit, 1MSPS, 4-Ch Small Form Factor Design for Test and Measurement Applications using four ADS8900B SAR ADCs, four OPA2625 precision amplifiers and one REF5050 precision reference.

ADS8920B ADS8922B ADS8924B
For step-by-step design procedure, circuit schematics, bill of materials, PCB files, simulation results, and test results, see also TI Precision Design TIPD211, 18-Bit, 1MSPS, 4-Ch Small Form Factor Design for Test and Measurement Applications (TIDUBW7).