SBASB73 August   2026 AFE7903-SEP

PRODMIX  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Transmitter Electrical Characteristics
    6. 4.6  RF ADC Electrical Characteristics
    7. 4.7  PLL/VCO/Clock Electrical Characteristics
    8. 4.8  Digital Electrical Characteristics
    9. 4.9  Power Supply Electrical Characteristics
    10. 4.10 Timing Requirements
    11. 4.11 Switching Characteristics
    12. 4.12 Typical Characteristics
      1. 4.12.1  RX Typical Characteristics 30MHz and 400MHz
      2. 4.12.2  RX Typical Characteristics at 800MHz
      3. 4.12.3  RX Typical Characteristics 1.75GHz to 1.9GHz
      4. 4.12.4  RX Typical Characteristics 2.6GHz
      5. 4.12.5  RX Typical Characteristics 3.5GHz
      6. 4.12.6  RX Typical Characteristics 4.9GHz
      7. 4.12.7  RX Typical Characteristics 6.8GHz
      8. 4.12.8  TX Typical Characteristics at 30MHz and 600MHz
      9. 4.12.9  TX Typical Characteristics at 800MHz
      10. 4.12.10 TX Typical Characteristics at 1.8GHz
      11. 4.12.11 TX Typical Characteristics at 2.6GHz
      12. 4.12.12 TX Typical Characteristics at 3.5GHz
      13. 4.12.13 TX Typical Characteristics at 4.9GHz
      14. 4.12.14 TX Typical Characteristics at 7.1GHz
      15. 4.12.15 PLL and Clock Typical Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Receiving Notification of Documentation Updates
    2. 5.2 Support Resources
    3. 5.3 Trademarks
    4. 5.4 Electrostatic Discharge Caution
    5. 5.5 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

4.4 Thermal Information

THERMAL METRIC FC-BGA UNIT
400 PINS
RθJA Junction-to-ambient thermal resistance 15.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.44 °C/W
RθJB Junction-to-board thermal resistance 4.8 °C/W
ΨJB Junction-to-board characterization parameter 4.5 °C/W