SBOS918B March   2018  – June 2026 OPA197-Q1 , OPA2197-Q1 , OPA4197-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: OPA197-Q1
    5. 5.5 Thermal Information: OPA2197-Q1
    6. 5.6 Thermal Information: OPA4197-Q1
    7. 5.7 Electrical Characteristics: VS = ±4 V to ±18 V (VS = 8 V to 36 V)
    8. 5.8 Electrical Characteristics: VS = ±2.25 V to ±4 V (VS = 4.5 V to 8 V)
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Protection Circuitry
      2. 6.3.2 EMI Rejection
      3. 6.3.3 Phase Reversal Protection
      4. 6.3.4 Thermal Protection
      5. 6.3.5 Capacitive Load and Stability
      6. 6.3.6 Common-Mode Voltage Range
      7. 6.3.7 Electrical Overstress
      8. 6.3.8 Overload Recovery
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 16-Bit Precision Multiplexed Data-Acquisition System
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Slew-Rate Limit for Input Protection
      3. 7.2.3 Precision Reference Buffer
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 8.1.1.2 TI Precision Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.6 Thermal Information: OPA4197-Q1

THERMAL METRIC(1) OPA4197-Q1 UNIT
D (SOIC) PW (TSSOP)
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 86.4 108.1 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 46.3 26.3 °C/W
RθJB Junction-to-board thermal resistance 41.0 54.4 °C/W
ψJT Junction-to-top characterization parameter 11.3 1.4 °C/W
ψJB Junction-to-board characterization parameter 40.7 53.3 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.