SBVS466 November   2025 TPS7N49

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Enable and Shutdown
      2. 6.3.2 Active Discharge
      3. 6.3.3 Power-Good Output (PG)
      4. 6.3.4 Internal Current Limit
      5. 6.3.5 Thermal Shutdown Protection (TSD)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input, Output, and Bias Capacitor Requirements
      2. 7.1.2 Dropout Voltage
      3. 7.1.3 Output Noise
      4. 7.1.4 Estimating Junction Temperature
      5. 7.1.5 Soft-Start, Sequencing, and Inrush Current
      6. 7.1.6 Power-Good Operation
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Board Layout
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPS7N49 UNIT
DSQ (VSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 62.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance
89.3		 °C/W
RθJB Junction-to-board thermal resistance
28.6		 °C/W
ψJT Junction-to-top characterization parameter
2.8		 °C/W
ψJB Junction-to-board characterization parameter
28.5		 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance
3.4		 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.