SBVS477A May   2025  – July 2025 TPS7B4259-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information 
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Tracker Output Voltage (VOUT)
        1. 6.3.1.1 Output Voltage Equal to Reference Voltage
        2. 6.3.1.2 Output Voltage Less Than the Reference Voltage
      2. 6.3.2 Reverse Current Protection
      3. 6.3.3 Power Good
      4. 6.3.4 Undervoltage Lockout
      5. 6.3.5 Thermal Protection
      6. 6.3.6 Current Limit
      7. 6.3.7 Output Short to Battery
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Operation With VIN < 3.3V
      4. 6.4.4 Disable With ADJ and EN Controls
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Dropout Voltage
      2. 7.1.2 Reverse Current
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input and Output Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Package Mounting
        2. 7.4.1.2 Board Layout Recommendations to Improve PSRR and Noise Performance
        3. 7.4.1.3 Power Dissipation and Thermal Considerations
        4. 7.4.1.4 Thermal Performance Versus Copper Area
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.4.1.4 Thermal Performance Versus Copper Area

The most used thermal resistance parameter RθJA is highly dependent on the heat-spreading capability built into the particular PCB design. RθJA therefore varies according to the total copper area, copper weight, and location of the planes. The RθJA recorded in the Thermal Information  table is determined by the JEDEC standard (Figure 7-6), PCB, and copper-spreading area. This parameter is only used as a relative measure of package thermal performance. For a well-designed thermal layout, RθJA is actually the sum of RθJCbot plus the thermal resistance contribution by the PCB copper. RθJCbot is the package junction-to-case (bottom) thermal resistance, as given in the Thermal Information  table.

TPS7B4259-Q1 JEDEC Standard 2s2p PCBFigure 7-6 JEDEC Standard 2s2p PCB