SCDS124D July   2003  – October 2026 SN74CB3Q3245

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Pin Configuration and Functions
  5. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics
    7. 4.7 Typical Characteristics
  6. 5Parameter Measurement Information
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

4.4 Thermal Information

THERMAL METRIC(1)SN74CB3Q3245UNIT
DBQ (SSOP)DGV (TVSOP)PW (TSSOP)RGY (VQFN)
20 PINS20 PINS20 PINS20 PINS
RθJAJunction-to-ambient thermal resistance

99.04

115.29

100.43

71.1

°C/W
RθJC(top)Junction-to-case (top) thermal resistance63.0553.2144.9968°C/W
RθJBJunction-to-board thermal resistance63.2573.7162.4846.5°C/W
ψJTJunction-to-top characterization parameter29.0112.589.3319.8°C/W
ψJBJunction-to-board characterization parameter62.5573.1262.0046.6°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/A31.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application note.