SCDS149B October   2003  – December 2025 SN74CB3T3257

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Recommended Operating Conditions
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics 85C
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
      2. 9.1.1 Receiving Notification of Documentation Updates
      3. 9.1.2 Support Resources
      4. 9.1.3 Electrostatic Discharge Caution
      5. 9.1.4 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Detailed Design Procedure

The 4-bit bus is connected directly to the 1A, 2A, 3A, and 4A ports (known as the xA port) on the SN74CB3T3257. This splits into two buses, out of the xB1 and xB2 ports. When S is high, xB2 is the active bus, and when S is low, xB1 is the active bus. This means that Device 2 is connected to the bus controller when S is high, and Device 1 is connected to the bus controller when S is low. This setup is useful when two devices are hard coded with the same address and only one bus is available. The OE connection can be used to disconnect all devices from the bus controller if necessary.

The 0.1µF capacitor on VCC is a decoupling capacitor and must be placed as close as possible to the device.