SN74CB3T3257

ACTIVE

Product details

Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Configuration 2:1 SPDT Number of channels 4 Bandwidth (MHz) 100 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Operating temperature range (°C) -40 to 85 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 5 CON (typ) (pF) 4 OFF-state leakage current (max) (µA) 10 Ron (max) (mΩ) 8000 VIH (min) (V) 1.7 VIL (max) (V) 0.8 Rating Catalog
Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Configuration 2:1 SPDT Number of channels 4 Bandwidth (MHz) 100 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Operating temperature range (°C) -40 to 85 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 5 CON (typ) (pF) 4 OFF-state leakage current (max) (µA) 10 Ron (max) (mΩ) 8000 VIH (min) (V) 1.7 VIL (max) (V) 0.8 Rating Catalog
TVSOP (DGV) 16 23.04 mm² (3.6 mm × 6.4 mm) TSSOP (PW) 16 32 mm² (5 mm × 6.4 mm) SOT-23-THN (DYY) 16 8.4 mm² (4.2 mm × 2 mm)
  • Output voltage translation tracks VCC
  • Supports mixed-mode signal operation on all data I/O ports
    • 5V input down to 3.3V output level shift with 3.3V VCC
    • 5V/3.3V input down to 2.5V output level shift with 2.5V VCC
  • 5V-tolerant I/Os with device powered up or powered down
  • Bidirectional data flow with near-zero propagation delay
  • Low ON-state resistance (ron) characteristics (ron = 5Ω typ)
  • Low input/output capacitance minimizes loading (Cio(OFF) = 5pF typ)
  • Data and control inputs provide undershoot clamp diodes
  • Low power consumption (ICC = 20µA max)
  • VCC operating range from 2.3V to 3.6V
  • Data I/Os support 0V to 5V signaling levels (0.8V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, 5V)
  • Control inputs can be driven by TTL or 5V/3.3V CMOS outputs
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 250mA per JESD 17
  • ESD performance tested per JESD 22
    • 2000V human-body model (A114B, Class II)
    • 1000V charged-device model (C101)
  • Output voltage translation tracks VCC
  • Supports mixed-mode signal operation on all data I/O ports
    • 5V input down to 3.3V output level shift with 3.3V VCC
    • 5V/3.3V input down to 2.5V output level shift with 2.5V VCC
  • 5V-tolerant I/Os with device powered up or powered down
  • Bidirectional data flow with near-zero propagation delay
  • Low ON-state resistance (ron) characteristics (ron = 5Ω typ)
  • Low input/output capacitance minimizes loading (Cio(OFF) = 5pF typ)
  • Data and control inputs provide undershoot clamp diodes
  • Low power consumption (ICC = 20µA max)
  • VCC operating range from 2.3V to 3.6V
  • Data I/Os support 0V to 5V signaling levels (0.8V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, 5V)
  • Control inputs can be driven by TTL or 5V/3.3V CMOS outputs
  • Ioff supports partial-power-down mode operation
  • Latch-up performance exceeds 250mA per JESD 17
  • ESD performance tested per JESD 22
    • 2000V human-body model (A114B, Class II)
    • 1000V charged-device model (C101)

The SN74CB3T3257 is a high-speed TTL-compatible FET multiplexer/demultiplexer with low ON-state resistance (ron), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks VCC. The SN74CB3T3257 supports systems using 5V TTL, 3.3V LVTTL, and 2.5V CMOS switching standards, as well as user-defined switching levels.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature verifies that damaging current does not backflow through the device when the device is powered down. The device has isolation during power off.

The SN74CB3T3257 is a high-speed TTL-compatible FET multiplexer/demultiplexer with low ON-state resistance (ron), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks VCC. The SN74CB3T3257 supports systems using 5V TTL, 3.3V LVTTL, and 2.5V CMOS switching standards, as well as user-defined switching levels.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature verifies that damaging current does not backflow through the device when the device is powered down. The device has isolation during power off.

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Technical documentation

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* Data sheet SN74CB3T3257 4-Bit 1-of-2 FET Multiplexer/Demultiplexer 2.5V/3.3V Low-Voltage Bus Switch With 5V-Tolerant Level Shifter datasheet (Rev. B) PDF | HTML Dec 9, 2025
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML Jun 2, 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML Dec 1, 2021
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML Jan 6, 2021

Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
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Simulation model

HSPICE Model for SN74CB3T3257

SCDM117.ZIP (102 KB) - HSpice model
Supported products & hardware
Simulation model

SN74CB3T3257 IBIS Model

SCDM059.ZIP (25 KB) - IBIS model
Supported products & hardware
Package Pins CAD symbols, footprints & 3D models
TVSOP (DGV) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian
SOT-23-THN (DYY) 16 Ultra Librarian

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