SCDS149B October   2003  – December 2025 SN74CB3T3257

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Recommended Operating Conditions
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics 85C
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1.      Related Documentation
      2. 9.1.1 Receiving Notification of Documentation Updates
      3. 9.1.2 Support Resources
      4. 9.1.3 Electrostatic Discharge Caution
      5. 9.1.4 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.2.1 Design Requirements

  1. Recommended Input Conditions:
    • For specified high and low levels, see VIH and VIL in Section 5.3.
    • Inputs and outputs are overvoltage tolerant slowing them to go as high as 4.6V at any valid VCC.
  2. Recommended Output Conditions:
    • Load currents must not exceed ±128mA per channel.
  3. Frequency Selection Criterion:
    • Maximum frequency tested is 200MHz.
    • Added trace resistance/capacitance can reduce maximum frequency capability; use layout practices as directed in Section 8.4.